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• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Boards.
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
z
: Through hole.
•
W : indicates side identified with part number.
•
f
: internal component
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• EGL board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in the diagram.
• Lead Layouts
Lead layout of conventional IC
CSP (chip size package)
XP-ZR850
SECTION 5
DIAGRAMS
Note on Schematic Diagrams.
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
f
: internal tolerance.
• C : panel designation.
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• H : adjustment for repair.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : CD PLAY
(
) : FM
[
] : AM
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
surface
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
F
: FM
f
: AM
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that conventional IC.
• Abbreviation
E/4
: Argentina model
E19
: South African, Singapore, Malaysia, Vietnam
and Indian model
E92
: Panama, Venezuelan and Caribbian Can model
MX
: Mexican model
• Waverforms
– EGL Board –
X602
1
1.1 Vp-p
45.5 ns
500 mV/DIV, 20 n s/DIV
11
11
– JACK Board –
IC101 qg (X_0) (FM mode)
qa
1.6 Vp-p
13.3 µs
1 V/DIV, 5 µ s/DIV
IC101 qg (X_0) (AM mode)
qa
0.5 Vp-p
13.3 µs
200 mV/DIV, 5 µ s/DIV
Q104 (Collector) (FM mode)
qs
2.2 Vp-p
195 ns
1 V/DIV, 50 n s/DIV
Q104 (Collector) (AM mode)
qs
1.2 Vp-p
195 ns
500 mV/DIV, 50 n s/DIV
IC401 wd (SYNC)
qd
(CD play mode)
2.1 Vp-p
2.8 µs
1 V/DIV, 1 µ s/DIV
IC401 ta (LO_2), ts (LO_1)
qf
2.7 Vp-p
2.8 µs
1 V/DIV, 1 µ s/DIV
XP-ZR850
Ver. 1.2
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