Lead-Free Requirement - Philips BDP7100/12 Service Manual

2.5 Lead Free Requirement
Information about Lead-free produced sets
Philips CE is starting production of lead-free sets from
1.1.2005 onwards.
INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from 1 Jan 2005 onwards,
according next rules.
Example S/N:
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
the week number, so in this case 1991 wk 18
So from 0501 onwards = from 1 Jan 2005 onwards
Important note: In fact also products of year 2004 must be treated in this way as long as
you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the
higher temperatures belong to this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-pate
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste within
workshops should be avoided because paste is not easy
to store and to handle.
• Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C – 380°C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will be
destroyed. To avoid wear-out of tips switch off un-used
equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is poss ble but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product is
lead-free, clean carefully the solder-joint from old solder
alloy and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities) has
to be purchased at external companies.
Precautions 3139 785 32970
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-soldering
always use the lead-free temperature profile, in case of
doubt)
- lead free BGA-ICs will be delivered in so-called 'dry-
packaging' (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening, dependent
of MSL-level seen on indicator-label in the bag, the
BGA-IC possibly still has to be baked dry. (MSL=Moisture
Sensitivity Level). This will be communicated via AYS-
website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products of
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
service-period. For repair of such sets nothing changes.
• On our website www.atyourservice.ce.Philips.com you
find more information to:
 BGA-de-/soldering (+ baking instructions)
 Heating-profiles of BGAs and other ICs used in Philips-
sets
You will find this and more technical information within
the "magazine", chapter "workshop news".
For additional questions please contact your local repair-helpdesk.
2. EN 9