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Mounting Methods
1. The example of temperature profile (reflow soldering)
(*)The product is evaluated using above reflow soldering conditions. No additional test is performed
exceed the condition (i.e. the condition more than MAX values) as an evaluation.
Please perform reflow soldering under the above conditions.
•
The first reflow process should be performed under the above temperature profile within 168 h
after opening the bag.
•
If a second reflow process needs to be performed, it should be performed within 168 h of the first
reflow under the above temperature profile.
•
Storage conditions before the second reflow process: 30°C, 70% RH (max)
•
Do not perform wave soldering and manual soldering with a soldering iron.
2. Recommended soldering pattern
3. Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test
(under the recommended conditions).
In selecting the one for your actual usage, please perform sufficient review on washing condition,
using condition and etc.
180°C
160°C
4°C/s max (*)
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
10 s max (*)
250°C max (*)
4°C/s max (*)
30∼50 s
60∼120 s
Time (s) →
Unit: mm
1.0
1.5
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
5
TLP848
230°C
2007-10-01
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