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Embedded COM System User‘s Manual Product Number: 21265-010/020/030 April 2018 Doc-No: 63972-366_R1.5...
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R1.5 April 2018 rebranded Impressum: Schroff GmbH Langenalber Str. 96 - 100 75334 Straubenhardt, Germany The details in this manual have been carefully compiled and checked - supported by certified Quality Management System to EN ISO 9001/2000 The company cannot accept any liability for errors or misprints. The company reserves the right to amendments of technical...
21265-010/020/030 Table of Contents Safety ............................ 1 Safety Symbols used in this document ................1 General Safety Precautions....................1 References and Architecture Specifications..............1 Introduction.......................... 2 Schroff Embedded COM System ..................2 System Overview........................3 Disassemble the Case......................7 Schroff Carrier Board......................8 COM Carrier...........................
21265-010/020/030 1 Safety The intended audience of this User’s Manual is system integrators and hardware/software engineers. 1.1 Safety Symbols used in this document Caution! This is the user caution symbol. It indicates a condition where damage of the equipment or injury of the service personnel could occur.
21265-010/020/030 2 Introduction COM Express® is a PICMG® standard that describes a COM (Computer-On-Module) and the supporting Carrier Board. • The COM contains the processor, RAM, and I/O ICs. • The Carrier Board provides power to the COM, additional I/O ICs, and all of the I/O connections.
21265-010/020/030 2.2 System Overview 21265-010 21265-020 21265-030 Embedded COM Embedded COM Embedded COM System System Lab System Type 6 Compact module with Intel® Celeron® 3955U dual core processor; 4 GB DDR4-SODIMM-2400 Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor;...
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21265-010/020/030 Figure 1: Interfaces supported by the COM Modules Introduction R1.5, April 2018...
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21265-010/020/030 Figure 2: Embedded COM Systems Embedded COM System (Celeron) Air inlet Embedded COM System (i7) Power input Embedded COM Lab System Slot for optional Fieldbus Module Slot for XMC Module Introduction R1.5, April 2018...
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21265-010/020/030 Figure 3: Embedded COM Systems Overview Fan for XMC Module (Optional) Heatsink (Large for i7 COM Modules) XMC Module (Example, not scope of delivery) Heatsink (Small fpr Celeron COM Modules) Power Module Heatsink (Fixing Screws) Introduction R1.5, April 2018...
21265-010/020/030 2.3 Disassemble the Case Figure 4: Disassemble the Case Disassemble the case: • Remove the 2 screws (1) • Pull the frontpanel (2) forwards • Remove the screws (3) • Remove the heatsink (4) • Pull the top cover (5) upwards Introduction R1.5, April 2018...
21265-010/020/030 2.4 Schroff Carrier Board The Schroff COMET6 Carrier Board supports the Type-6 interface definition described in the PICMG COM Express Module Base Specification, and can be used with any Type-6 COM. This allows the user to select a Type-6 COM with as much or as little processing power as needed for the specific application.
21265-010/020/030 2.6 Fixing Post Layout When the factory-installed COM Module is replaced by an Module with a different form factor, some fixing posts mus be removed or added. Figure 6: Fixing Post Layout Introduction R1.5, April 2018...
21265-010/020/030 2.7 COM Carrier Connector and Jumper Overview Figure 7: COM Carrier Connector and Jumper Overview Blue: Jumper Red: Connector Introduction R1.5, April 2018...
21265-010/020/030 2.8 Jumper Settings Overview Jumper Settings X110 Vcc to USB 1-2: Vcc to USB in Suspend State 4 (COM Express Module) X111 Incorrect COM Module Type will dis- 1-2: Incorrect COM Module Type will disable Vcc (COM Express Module) able Vcc 2-3: Incorrect COM Module Type will not disable Vcc X113...
21265-010/020/030 3 Power 3.1 Power Input The Schroff COM Carrier provides a 2 row 2.54 mm pin header (X146) to connect to the Schroff power board. The power board generates the COM Carrier supply voltages (1.5 V, 3.3 V, 5 V, 12 V) from the system input voltage (18 - 26,4 VDC) Power Input Connector X146 Signal Signal...
21265-010/020/030 3.2 Power Connectors and Jumpers Jumpers: X110/X111: X110 Configuration X111 Configuration Vcc to USB in Suspend State 4 Type detection enable Vcc to USB in Suspend State 5 X113*: X113 Configuration GPIO on MicroSD in Socket X140 GPIO on Prototype Module * GPIO is not supported by the current COM Modules X138: Enable S0 Power (1.5 V and 12 V Jumper X138...
21265-010/020/030 4 Interfaces 4.1 LPC Super I/O Controller The Schroff COM Carrier integrates a W83627 Super I/O controller connected to the LPC Bus of the COM Express module. The Super I/O controller provides additional interfaces such as two serial ports and a parallel port. 4.2 Serial Interfaces The COM Carrier provides 3 serial ports routed to 2 connectors.
21265-010/020/030 4.3 Parallel Interface The Super I/O controller provides a parallel port at X 130 (2 row 2.54 mm pin header) Signal Signal STROBE# AFD# ERR# INIT# ACK# SLIN# BUSY SLCT 4.4 I2C-Bus, SMBus and CAN Interfaces The Super I/O controller provides I2C-Bus, SMBus and CAN Interfaces at X 106 (Molex C-Grid 2.54 mm header) Signal Signal...
21265-010/020/030 4.5 SPI Flash EEPROM The COM Carrier provides a socket (X107) for an optional flash EEPROM connected via the SPI to the COM Module. The SPI Flash EEPROM is an off-module option for the BIOS storage. Via 2 jumper (X115/X116) the user can determine the boot device. The connector X109 offers the possibility to program the SPI Flash EEPROM with an external programmer.
21265-010/020/030 4.6 USB The COM Module provides 4 USB3 ports (port 0-3) and 4 USB2 ports (port 4-7). • Ports 0-3 (USB3) are routed to the front terminals X119 and X154. • Port 4 is routed to the LVDS connector X144 •...
21265-010/020/030 4.9 PCI Express The COM Carrier provides a PCI Express x4 Card Edge Slot U103 (Link 0-3). Figure 9: Connector U103 4.10 MiniPCIe The COM Carrier provides 2 MiniPCIe slots (U142, U143) • U142 is connected to USB2 Port 7 and PCI Express Link 5, the User Identity Module (UIM) signals are routed to a Micro-SIM card reader (X126).
21265-010/020/030 4.11 XMC The COM Carrier supports Switched Mezzanine Cards (XMC) with a PCI Express 8 Lane Interface (PEG) at connector J15, according to VITA 42.3. Connector X135 is to supply an external -12 V to the XMC Module. With the jumper X120 the supply voltage can be switched between 5 V and 12 V.
21265-010/020/030 4.12 XMC I/O Plug-on Module The COM Carrier provides a J16 connector (X100) for the XMC Module and an additional connector for the XMC I/O Plug-on Module (X101). The signal lines between the connectors are connected 1:1. Figure 11: XMC Connectors J16 and XMC I/O Plug-on Module Connector XMC I/O Plug-on Module Power Connector Interfaces R1.5, April 2018...
21265-010/020/030 4.13 Fieldbus Interface The COM Carrier provides a connector (X143) for a Fieldbus Module. The connector provides the following interfaces: • PCIe Link 6 • CAN • I²C • SMB Figure 12: Fieldbus Module Connector X143 Interfaces R1.5, April 2018...
21265-010/020/030 4.14 LVDS Interface The COM Carrier provides an interface for an LVDS Module at connector X144. Figure 13: LVDS Connector X144 Interfaces R1.5, April 2018...
21265-010/020/030 4.15 Prototype Interface The COM Carrier provides an interface for an Prototype Module at connector X145. Figure 14: Prototype Connector X145 Interfaces R1.5, April 2018...
21265-010/020/030 4.16 Fan Control The Schroff COM Carrier provides 3 fan connectors. • X112: Connector for 4 (2) wire fans controlled by the Super I/O controller* • X118: Connector for 3 wire fans controlled by the COM Module • X150: Connector for 4 wire fans controlled by the COM Module X112 X118 X150...
21265-010/020/030 4.17 Audio Interfaces The Schroff COM Carrier provides an HDA audio codec (Realtek ACL886). The audio interfaces are available at the front connector block X151. The connectors are 3.5 mm stereo jacks and a TOSLINK optical audio output. Audio Interfaces X151 Ring Sleeve...
21265-010/020/030 4.18 Video Interfaces The Schroff COM Carrier provides digital and analog Video Interfaces. • X153: DVI-D on front panel • X108/X129: 2x Display Port on front panel • X149: VGA on rear panel Interfaces R1.5, April 2018...
21265-010/020/030 5 Technical Data Table 1: Technical Data Dimensions Height w.o. heatsink 44.45 mm (1U) Width (Lab system) 250 mm (375.5 mm) Depth 250 mm Power Input voltage 18 - 26,4 VDC Input current 10 -7 A Environmental Ambient temperature (long term) +5°C…+45°C (41°F to 104°F) Humidity +5%...+85%, no condensation...
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