HP W1858 Disassembly Instructions Manual page 2

including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
ESD wrist ring Wrist which forfend static
ESD glove Glove which forfend static
Screwdriver type:3220/5200、shank type2#：φ=5mm、L=85mm
Screwdriver type:3220/5200、shank type hexagram：φ=5mm、L=85mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle BEZEL
3. Dismantle the button，pull out the pin of KEPC board ,get
4. Pull out the PIN of power of key board ,and get down it
5. Rdismantle REAR COVER
6. Dismantle the D-SUB screws and HDMI screws
7. Pull out the pin of speaker , get down the right and left speaker .
8. Pull out the PIN of lamp
9. Dismantle the screws of PANEL
10. Pull out the PIN of FFC cabel， separate the
11. Dismantle the screws of main board and PWPC board
12. First :tear off the black tape ;Second: pull out the connector PIN which connect
both boards
13. Pull out the pin of KEPC cable and FFC cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
chambers, and service stations.
PSG instructions for this template are available at
down the KEPC board
mainframe and PANEL
PWPC and main board;Third: take off
EL-MF877-01
0
0
0
Tool Size (if
applicable)
1
1
1
1
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