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Item Description
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Screw driver of "+" type
Hexagonal nut screw driver for DVI and D-SUB connector
Scraper
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove the base assy through pushing the key on rear cover
2. Remove the rear cover and bezel through remove screws on bottom side.
3. Remove the hinge
4. Remove the tapes and the pins
5. Remove the screws to remove next to connector side
6. Remove the pin and white tapes and then remove mainframe to get panel
7. Remove the screws and pins to take out main board and side USB board
8. Remove the pins from main board and USB board to get clear EE board and main frame
9. Remove key board and LED board mount on rear cover to get clear rear cover
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
Include the cartridges, print heads, tubes, vent chambers,
and service stations.
HPI instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in
product
0
0
0
0
0
0
Tool Size (if
applicable)
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