HP 2011s Disassembly Instructions page 2

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Hexagonal inserted handle box wrench
Pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use srew driver to remove 5 screws that attaches monitor head Figure 1
2. Use both hands to pull up the Bezel at where the arrow indicates Figure 2
3. Rremove the screws from bezel and shielding bottom side. Figure 3
4. Remove the AL-tape*2, FFC connector *2 and adhesive tape*1 Figure 4
5. Remove the Hexagonal screws with Hexagonal inserted handle box wrench Figure 5
6. Remove 3 screws from PCB to shielding.Figure 6
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1.
Figure 2.
EL-MF877-00
Template Revision A
Tool Size (if
applicable)
#2
Page 2