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HP-00007-01, Appendix 3
Components, parts and materials
containing radioactive substances
2.0
Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Screwdriver
Screwdriver
Screwdriver
3.0
Product Disassembly Process
3.1
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
Remove 6 cell battery
2
Remove M2.5*6L screws on HDD door, then remove HDD and ODD module.
3
Remove M2.5*6L screws and M2*3L screws on lower case , then reverse it.
4
Remove middle cover assy., then remove M2*3L screws on upper case.
5
Remove keyboard and LCD assy.
6
Remove M2*12L screws and M2*3L screws on upper case.
7
Remove upper case assy.
8
Remove M2.5*6L screws, then remove MB.
9
Remove IO/R and lower case assy.
10
Divide MB from connecter and Remove RTC coin cell battery on MB for selective
treatment.
11
Remove six M2.5*6L screws, then remove LCD bezel
12
Remove two M2.5*5L screws, then remove daughter board and LCD module.
13
Remove four M2*2L screws on middle cover assy., then Remove launch board.
14
Disassemble LCD assembly and remove mercury bulb for selective treatment.
3.2
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
13-Oct-2004
0
Tool Size (if applicable)
Type-Phillip #1
Type-Phillip #0
Type-T #8
Page 2
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