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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description T15 screw driver (Disassemble 3 pcs screws for side bkt and main bkt)
Description T15 screw driver (Disassemble 3 pcs screws for ODD cage and main bkt)
Description T15 screw driver (Disassemble 4 pcs screws for FIO module and main bkt)
Description T15 screw driver (Disassemble 2 pcs screws for PCI cover and main bkt)
Description T15 screw driver (Disassemble 4 pcs screws for MB and main bkt)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove to lower case from hosing.
2.
Remove ODD latch and Front Bezel from hosing
3.
Loosen 2 screws on cage brkt then rotate remove HDD latch
4.
Pull off all cables on MB
5.
Loosen 12 screws on MB then remove it
6.
Loosen 3 screws/ 4 screws on PSU then remove it
7.
8.
9.
10. .
11. .
12.
13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove to lower case from hosing.
Tool Size (if
applicable)
T15 3.0~4.0
kgf-cm
T15 3.0~4.0
kgf-cm
T15 3.0~4.0
kgf-cm
T15 3.0~4.0
kgf-cm
T15 3.0~4.0
kgf-cm
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