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HP 260 G2 DM Business Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 260 G2 DM Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
1
1
0
0
0
0
0
0
0
0
0
Page 1

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Summary of Contents for HP 260 G2 DM Business

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 MANUFACTURING PROCESS INSTRUCTIONS MECHANICAL ASSEMBLY MODEL : Pippin 2 Sub-assembly name: FA DIS ASS‘Y Document No.: Pippin 2 FA DIS ASS'Y SOP Written by: Stanley Chen Revision: Date: 2016/02/23 Page: A. Current station version list Station Ver. Station Ver. Station Ver.
  • Page 4 Standard Operation Procedure 1(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Loosen Screw / Remove Top Case Step: 1. Put the machine on support fixture, then loosen screw. (6052B0313401 ,T15, Loosen screw M3x6 ).
  • Page 5 Standard Operation Procedure 2(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble DRAM Step: 1. Disassemble DRAM. (Fig.1) Fig.1 Notes : If finding anything uncommon, notice foreman or assistant at once. Holding fixture list (holding fixture standard) Holding fixture list (holding fixture standard) Auditor :Stanley Chen NPSU-PPE...
  • Page 6 Standard Operation Procedure 3(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble Fan Step: 1. Disassemble fan (6033B0042101) cable connector. (Fig.1)  Fig.3 is Screwdriver picture 2. Loosen fan screw * 2. (Fig.2) Fan connector Fig.1 Fig.3...
  • Page 7 Standard Operation Procedure 4(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date Disassemble Thermal Module 2016/02/23 Step: 1. Loosen thermal module set screw * 4. (Fig.1)  Fig.2 is Screwdriver picture 2. Disassemble thermal module (6043B0201901 /6043B0202001) from MB.
  • Page 8 Standard Operation Procedure 5(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble HDD/SSD Step: 1. Unlock HDD cage lock, slide the HDD to the left to remove the HDD from cage. (Fig.1/ Fig.2) HDD Cage lock 2.
  • Page 9 Standard Operation Procedure 6(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date Loosen HDD / SSD Screws 2016/02/23 Step: 1. Put the HDD / SSD on support fixture, loosen guide pin screw (6054B1522101) * 4. (Fig.1 / Fig.2) ...
  • Page 10 Standard Operation Procedure 7(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Loosen Screws / Disassemble FFC Step: 1. Loosen HDD Tray screw (6052B0348301 T15, #6-32 ) * 3. (Fig.1) 2. Disassemble HDD/SSD FFC from MB CNTR and disassemble HDD tray.
  • Page 11 Standard Operation Procedure 8(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble Speaker Step: Speaker 1. Disassemble white speaker PIN (6051B1070601). (Fig.1) 2. Disassemble speaker (6039B0080201/ 6039B0080301). (Fig.2) 3. Disconnect speaker cable from M/B. (Fig.2) Speaker PIN Fig.1 Speaker CNTR位置...
  • Page 12 Standard Operation Procedure 9(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble WLAN Card Step: 1. Disassemble antenna plug. (Fig.1) 2. Loosen screw (6052B0228001,T8 M2,0*3.0) * 1. (Fig.2)  Fig.3 is Screwdriver picture 3.
  • Page 13 Standard Operation Procedure 10(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble MB Step: 1. Loosen M/B screw (6052B0310201 ,T15, #6- 32x6 ) * 4. (Fig.1)  Fig.3 is Screwdriver picture 2. Disassemble M/B. (Fig.2) Fig.1 Fig.2 Fig.3...
  • Page 14 Standard Operation Procedure 11(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date Disassemble Antenna Cover, Antenna (AUX) 2016/02/23 Step: 1. Disassemble antenna cover (6051B1068701). (Fig.1) 2. Rip the gaskets, disassemble antenna from hooks. (Fig.2) Antenna Cover Fig.1 3.
  • Page 15 Standard Operation Procedure 12(1/1) Document No. Pippin 2 FA DIS ASS’Y SOP Station : Name Ver. : Date 2016/02/23 Disassemble Antenna (Main) Step: 1. Rip the gaskets, disassemble antenna from hooks. (Fig.1) 2. Disassemble antenna (Main). (Fig.2) Fig.1 Antenna(Main) Fig.2 Notes : If finding anything uncommon, notice foreman or assistant at once.