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5-3.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board and SUB board are six-layer printed boards.
However, the patterns of layers 2 to 5 have not been included
in these diagrams.
* Replacement of C5000, IC5600, IC7001and IC8000 used
in this set requires a special tool.
• Lead Layouts
Lead layout of conventional IC
surface
CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in F unless otherwise noted. pF:
50 WV or less are not indicated except for electrolytics
and tantalums.
1
• All resistors are in
and
/
4
specified.
•
%
: indicates tolerance.
• A : B+ Line.
• Power voltage is dc 1.2 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
• no mark : PLAYBACK
(
) : when USB connection
• Voltages are taken with a VOM (Input impedance 10 M ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PLAYBACK
E
: Check-out
j
: Check-in
* Replacement of IC5000, IC5600, IC7001and IC8000
used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
NW-MS6
F
W or less unless otherwise
17
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