MeiVac MAK Series Owner's Operation And Maintenance Manual

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OWNER'S OPERATION

AND

MAINTENANCE MANUAL

OF THE

MAK SPUTTERING SOURCES

5830 Hellyer Avenue

San Jose, CA 95138

PH: (408) 362.1000 FX: (408) 362.1010

E-MAIL: support@meivac.com

YOUR S/N _____________________________

WARNING

AS WITH ALL ELECTRICAL DEVICES, THERE IS A SHOCK HAZARD

ASSOCIATED WITH THIS DEVICE.

ALL INSTRUCTIONS SHOULD BE

FOLLOWED PERTAINING TO THE USE OF SUITABLE INTERLOCKS ON ALL

POWER SUPPLIES TO BE USED TO POWER THIS PRODUCT.

Issued September 11, 2008

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Page 1 OF THE MAK SPUTTERING SOURCES 5830 Hellyer Avenue San Jose, CA 95138 PH: (408) 362.1000 FX: (408) 362.1010 E-MAIL: support@meivac.com YOUR S/N _____________________________ WARNING AS WITH ALL ELECTRICAL DEVICES, THERE IS A SHOCK HAZARD ASSOCIATED WITH THIS DEVICE. ALL INSTRUCTIONS SHOULD BE FOLLOWED PERTAINING TO THE USE OF SUITABLE INTERLOCKS ON ALL POWER SUPPLIES TO BE USED TO POWER THIS PRODUCT.
Page 2 Precautions to assure the proper operation of your MAK Source MUST • Water be flowing thru the MAK while sputtering. Please see O&M manual for flow requirements. CAUTION DO NOT If MAK has been operated without water --- turn the water on --- allow the MAK to cool down before turning water on.
Page 3: Table Of Contents
Table of Contents Introducing US, a Division of MeiVac, Inc.................... 4 MeiVac, Inc. QUALITY ASSURANCE ....................4 Introducing MAK Sputter Sources......................4 Magnetron Sputtering?.......................... 5 RF Sputtering............................7 Operation of the MAK ..........................8 ……………………………………………………………………………………………………………9 ACUUM YSTEMS Installation of Sources......................... 10 Power Hook-up .............................
Page 4: Introducing Us, A Division Of Meivac, Inc
MeiVac, Inc. QUALITY ASSURANCE All MeiVac products are manufactured under the most stringent conditions. This includes proper selection & inspection of original materials, assembly in clean environments, and complete testing for leaks & functionality. These quality products are packaged in durable containers for shipment throughout the world.
Page 5: Magnetron Sputtering
MAGNETRON SPUTTERING Observations of the phenomenon we now call sputtering, go back over one hundred years to early experiments which introduced electricity into a reduced pressure atmosphere. L. Holland de- scribes these beginnings in his book Vacuum Deposition of Thin Films. “When an electrical discharge is passed between electrodes at a low gas pressure, the cathode electrode is slowly disintegrated under the bombardment of the ionized gas molecules.
Page 6 In order to increase sputtering rate, magnetic coils were sometimes placed around the chamber to pinch the plasma during the deposition. The pressure was reduced to 20 microns (2 X 10 torr) and the rates increased. The electrodes were close together and the R.F. voltage was high. These conditions caused damage to semiconductor devices due to the high electron and secon- dary ion bombardment, which took place.
Page 7: Rf Sputtering
RF SPUTTERING If the target is an insulator, the neutralization process results in a positive charge on the target sur- face. This charge may grow to the point that the bombarding ions (±) are repelled and the sputter- ing process will stop. In order to make the process continue the polarity of the target must be re- versed to attract enough electrons from the discharge to eliminate the surface charge.
Page 8: Operation Of The Mak
(target) from the substrate during pre- cleaning of the target. Since the MAK Series will not operate properly if the shutter is positioned too close to the target, it is suggested that the total distance from target to shutter be at least 1”.
Page 9 To obtain ideal uniformity, the distance from source to substrate should be adjustable. Note: The rate will decrease by the square of the distance from source to sub- strate, however uniformity will be enhanced as this distance is increased. The chamber may be made of glass or metal. If the chamber is metal, a viewing port should be provided for observation during sputtering.
Page 10: Installation Of Sources
INSTALLATION OF SOURCES STANDARD MOUNTING To mount the source a QUICK COUPLE feedthrough adapter is required. A 0.75” adapter is used for the 1.3”, 2”, and 3”, and 4” sources. The 6” MAK requires a 1.25” quick coupler adapter. Water Lines Power Connector (HN) End Adapter...
Page 11 7. Slide the End Adapter on the tube, making sure that the slip pin in the connector body is serted in the socket of the power feed rod. Push on as far as it will go and tighten the screws. 8.
Page 12: Power Hook-Up
POWER HOOK-UP All MAK sputter sources may be operated in either the DC or RF mode. All models are supplied with an HN (Amphenol UG-496/U) for convenient electrical connection to your choice of power source. The following US Sputtering Power Supplies come complete with output cables having the HN mating connector.
Page 13 RF Generator Auto Tuning Network D Connector to D Connector 50 Pin Connectors with metal covers Power Connection 12’ RG-8U Cable with N Type Connections Input Power Connection 3’ or 5’ RG 393/U Cable with HN Connector OUTPUT TO SPUTTERING CAUTIONS IN RF HOOK-UP Cable length between should be a derivative of the 13.56 MHz.
Page 14: Target Parameters
TARGET PARAMETERS Purity Target material for the MAK sputtering source is not confined to a minimum or maximum purity level. This parameter is dependent upon film requirements. Surface The mounting (bottom side) surface of the target should be smooth and flat to allow good contact to source.
Page 15: Machinable Materials
Machinable Materials The target keeper can be attached to machinable materials by drilling and tapping the target to 90% of it’s thickness and attaching the keeper using a vented flat head screw. TARGET MOUNTING OF THE MAK MACHINABLE MATERIALS By attaching a magnetic keeper to the target, the MAK source uses the magnetics of the gun to hold the target in place.
Page 16: Non-Machinable Materials
Non-Machinable Materials Ceramic and oxide materials, a copper backing plate containing a magnetic keeper should be used. The target must be bonded to this backing plate and this bond must be able to withstand a temperature of 220 TARGET MOUNTING OF THE MAK NON-MACHINABLE MATERIALS Cu plate with Backing Plates...
Page 17 Copper Backing Plate Specifications (See Appendix A) MAK 1.3” Copper Backing Plate Part Number: MAK-130-BP MAK 2” Copper Backing Plate Part Number: MAK-200-BP MAK 3” Copper Backing Plate Part Number: MAK-300-BP MAK 4” Copper Backing Plate Part Number: MAK-400-BP MAK 6” Copper Backing Plate Part Number: MAK-600-BP Caution Failure to use thermal contact paste or a thin metal foil as an interface layer between the...
Page 18: Rate Vs. Power
RATE VS. POWER When gathering rate data, it is also CO PPER 2" Dia., 3" Dist. desirable to take rates at different 40.00 power levels. These values can be 35.00 plotted to produce a graph similar to 30.00 the one shown. Å...
Page 19: Relative Rates Of Sputtering Sources Vs Distance
RELATIVE RATES OF SPUTTERING SOURCES VS DISTANCE Rate data, for sputtering with small sources, is usually taken by making step samples and then measuring them with either profilometer or interferometer. A quartz crystal micro- balance type rate monitor may also be used. If a rate monitor is used, the geometry and the density of the deposit must be taken into account.
Page 20: Returns & Warranty
Be prepared to give the serial number of the unit. This consultation call shall be at no charge to the Purchaser and will allow MeiVac or its distributor to determine if the unit must actually be re- turned for a problem to be corrected.
Page 21: Appendix A: Mak Technical Specifications
Appendix A MAK TECHNICAL SPECIFICATIONS MAK 1.3" MAK 2" MAK 3" MAK 4" MAK 6" MAK SIZE: (33mm) (50.8mm) (76.2mm) (101.6mm) (152.4mm) TARGET 1.00-5.70 1.00-9.50 1.00-15.90 1.00-19.05 2.00-25.40 Target Thickness inch 0.040-0.225 0.040-0.375 0.040-0.625 0.040-0.750 0.080-1.000 min-max 1.00-2.54 1.00-4.70 1.00-6.35 1.00-9.50 2.00-11.00 Magnet Target- (1)
Page 22 Appendix A MAK TECHNICAL SPECIFICATIONS COOLING MAK 1.3" MAK 2" MAK 3" MAK 4" MAK 6" (33mm) (50.8mm) (76.2mm) (101.6mm) (152.4mm) Water Flow at l/min 3.48 3.48 3.48 3.48 7.00 30psi min. at gal/min 0.90 0.90 0.90 0.90 1.840 lowest power level l/min 6.20 6.20...
Page 23: Appendix B: Target Suppliers
APPENDIX B TARGET SUPPLIERS ACI Alloys, Inc. SCI Engineered Materials 1985 Las Plumas Avenue 2839 Charter St. San Jose, CA 95133 Columbus, OH 43228 Larry Albert PH: (800) 346-6567 PH: (408) 259-7337 FX: (800) 292-8654 FX: (408) 729-0277 www.sciengineeredmaterials.com www.acialloys.com Cerac, Inc.
Page 44 1.3” MAK US Part Number Description L130-04 Ceramic Ground Shield L130-06 Ring Magnet L130-09 Stainless Steel Ground Shield L130A14 Block Assembly J1200-06 Center Magnet J1200-33 O-Ring J1200-34M Metal Seals J1234-30 Water Lines (2) w/ ferrules LL-130-01 Keeper w/ hole & screw (pkg. 10) MAK-130-BP Copper Backing Plate w/ Keeper TP-832...
Page 45 2.0” MAK US Part Number Description L200-07 Ring Magnet L200-10 Aluminum Ground Shield L200A14 Block Assembly J1200-06 Center Magnet J1200-33 O-Ring J1200-34M Metal Seals J1234-30 Water Lines (2) w/ ferrules LL-200-01 Keeper w/ hole & screw (pkg. MAK-200-BP Copper Backing Plate w/ Keeper TP-832 Thermal Contact Paste - 0.5 oz.
Page 46 3.0” MAK US Part Number Description L300-10 Aluminum Ground Shield (OLD STYLE MAK SOURCE ONLY) L300-10NT Aluminum Ground Shield L300-13 Center Magnet L300-24 Ring Magnet L300A14 Block Assembly J3400-33 O-Ring J3400-34M Metal Seals J1234-30 Water Lines (2) w/ ferrules LL-300-01 Keeper w/ hole &...
Page 47 4.0” MAK US Part Number Description L400-10 Aluminum Ground Shield L400A20 Center Magnet Assembly L400A14 Block Assembly J4600-13 Center Magnet J4600-32 Ring Magnet Segment (10 @ 31.25 each) J3400-33 O-Ring J3400-34M Metal Seals J1234-30 Water Lines (2) w/ ferrules LL-400-01 Keeper w/ hole &...
Page 48 6.0” MAK US Part Number Description L600-10 Aluminum Ground Shield L600-40 O-ring Magnet Plug L600-41 O-Ring L600A14 Block Assembly L600A20 Center Magnet Assembly J4600-13 Center Magnet J4600-32 Ring Magnet Segments (16 @ 31.25 each) L600-42 Water Lines (2) w/ ferrules LL-600-01 Keeper w/ hole &...
Page 49 BENEFITS OF THE MAK SIMPLICITY IN SPUTTERING 1 OF 3 Cathode (Copper) Water Isolated from: • Only small volume above AlN has electrical potential applied, • MAGNETS - NO magnet erosion THUS….. • POWER - (ALL electrical components) • minimizing heated area - facilitating –...
Page 50 BENEFITS OF THE MAK SIMPLICITY IN SPUTTERING 2 OF 3 Magnetics Cathode Ring Magnet Balanced / Unbalanced • Magnet array is INTERCHANGEABLE from balanced or unbalanced. Disassembly of source NOT REQUIRED! No Magnetic Housing • Provides higher magnetic density at target surface THUS…..
Page 51 BENEFITS THE MAK SIMPLICITY IN SPUTTERING 3 OF 3 Physical Parameters PICTURE SHOWN IS NOT TO SCALE VACUUM SEAL One Vacuum Seal Anode • Elastomer (HV) or Metal (UHV) field • Height adjustable to target thickness - interchangeable Selectively positioning anode to same •...
Page 52 Simplicity in Sputtering INTRODUCING The MAK Planar Magnetron Sputtering Source...
Page 53 Simplicity in Sputtering Target Installation on the MAK Cathode Target Magnets Keeper...
Page 54 Simplicity in Sputtering • Targets mounted by attraction of the center magnet • No mechanical clamping of the target THUS….. • Ease of target change • Adjustable anode THUS….. • Allows for target thickness variations • Prevents material build up •...
Page 55 Simplicity in Sputtering MAK without target installed Target Adjustable Anode Keeper Cathode...
Page 56 Simplicity in Sputtering MAK with target installed Target mounted with Anode magnetic retracted keeper...
Page 57 Simplicity in Sputtering The MAK with target and anode Slotted anode allows for variable target thickness Anode adjusted to accommodate thicker target Target...
Page 58 Simplicity in Sputtering MAK target installed w/o anode 0.100+ gap between target and magnets Target Magnet segments...
Page 59 TARGET MOUNTING OF THE MAK NON-MACHINABLE MATERIALS 1 OF 2 Backing Plates Ceramics, oxides, and any other non- machinable targets are commonly Cu plate with drill bonded to a copper backing plate for and tapped all sputtering sources. hole Copper Backing Plate MAK Backing Plates Keeper with screw...
Page 60 TARGET MOUNTING OF THE MAK NON-MACHINABLE MATERIALS 2 OF 2 bond Bonded Target - Example This is an example of a SiO target bonded to a copper backing plate with magnetic keeper attached. target keeper copper backing plate...
Page 61 TARGET MOUNTING OF THE MAK MACHINABLE MATERIALS 1 OF 1 By attaching a magnetic keeper to the target, the MAK source uses the magnetics of the gun to hold the target in place. If you have old targets, NO PROBLEM! Drill and tap your existing targets as shown and attach the metallic keeper.

This manual is also suitable for:

Mak 1.3 inch Mak 2 inch Mak 6 inch Mak 3 inch Mak 4 inch