Reliability Features - Huawei MG323 Hardware Manual

HUAWEI MG323 GSM M2M Module
Hardware Guide

5.6 Reliability Features

Table 5-7 lists the test conditions and results of the mechanical reliability of the
MG323 module.
Table 5-7 Test conditions and results of the mechanical reliability of the MG323 module
Item
Low-temperature
storage
High-temperature
storage
Low-temperature
working
High-temperature
working
Damp heat cycling
Temperature shock
Condensation test
Dust test
Salty fog test
Issue 04 (2011-08-22)
Test Condition
Temperature: –40 º C ± 2º C
Test duration: 24 h
Temperature: 85 º C ± 2º C
Test duration: 24 h
Temperature: –30 º C ± 2º C
Test duration: 24 h
Temperature: 75 º C ± 2º C
Test duration: 24 h
High temperature: 55 º C ± 2º C
Low temperature: 25 º C ± 2º C
Humidity: 95%
Repetition times: 4
Test duration: 12 h + 12 h
Low temperature: –40 º C ± 2º C
High temperature: 85 º C ± 2º C
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
Temperature: –40 º C ± 2° C
Time for keeping condensed: 2 h
Recovery temperature: 25 º C ± 2° C
Recovery time: 5 min
Repetition times: 6
Dust density: 2 kg/m
Dust type: dry talcum powder
Size requirement: < 75 µm
Duration: 8 h
Temperature: 35° C
Density of the NaCl solution: 5± 1%
Spraying interval: 8 h
Duration of exposing the module to
the temperature of 35° C: 16 h
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Electrical and Reliability Features
Standard
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
3
IEC60068
IEC60068
39