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HP LA1*51g Series Disassembly Instructions Manual page 2

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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 SCREW DRIVER(PHILLIPS HEAD)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
External Electric Cables Dissecting Process
2.
Remove Stand Base From Display
3.
Remove Front Cover From Display Head
4.
Remove Rear Cover From Display Head
5.
Remove Mainframe &Panel
6.
Take Screw off From Power Bd & Main Bd & USB Bd & Remove Mainframe
7.
Remove Stand Cover From Stand&Base
8.
Remove Base Cover From Stand&Base
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision A
Tool Size (if
applicable)
#2
Page 2

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