Related Manuals for Murata SCC2000 SERIES
Summary of Contents for Murata SCC2000 SERIES
- Page 1 1 (17) ASSEMBLY INSTRUCTIONS FOR SCC2000 SERIES Technical Note Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com Rev. 2...
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Page 2: Table Of Contents
2 (17) Table of Contents Objective ............................. 3 Murata's 24-lead Dual In-line Package (DIL-24) ................ 3 DIL-24 Package Outline and Dimensions .................. 4 Tape and reel specifications ...................... 5 Printed Circuit Board (PCB) Level Guidelines ................7 PCB design recommendations ....................7 Solder paste .......................... -
Page 3: Objective
Objective This document provides general guidelines for Printed Circuit Board (PCB) design and assembly of Murata's SCC2000 series components. It should be emphasized that this document serves only as a design guideline to help develop the optimal assembly conditions. It is essential that users also use their own manufacturing practices and experience to be able to fulfill the needs of varying end-use applications. -
Page 4: Dil-24 Package Outline And Dimensions
The outline and dimensions for the DIL-24 package are presented in Figure 2. Figure 2. Outline and dimensions for DIL-24 package. Dimensions are in millimeters [mm]. All tolerances are according to ISO 2768-f unless otherwise specified. Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com... -
Page 5: Tape And Reel Specifications
4. Figure 3. Packing tape dimensions for the DIL-24 Package. Dimensions are in millimeters [mm]. Figure 4. Package orientation on the tape and unreeling direction on tape. Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com... - Page 6 The reel dimensions are presented in figure 5 and table 1 below. Dimensions are in millimeters [mm]. Figure 5. Reel dimensions. All dimensions are in millimeters [mm]. Table 1. Packing reel dimensions [mm]. 2max ∅ 13 (-0.2/+0.5) 100±1 32.4 (-0/+2.0) 38.4 Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com Rev. 2...
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Page 7: Printed Circuit Board (Pcb) Level Guidelines
Printed Circuit Board (PCB) Level Guidelines PCB design recommendations For optimal soldering and solder joint reliability results of Murata's DIL component, the PCB terminal pads should be designed larger than the package leads. Reference dimensions for the land pad design are presented in Figure 6. Note that this is only an example and e.g. -
Page 8: Stencil
Typically a vacuum nozzle is used. Pick up nozzles are available in various sizes and shapes to suit a variety of different component geometries. Murata's DIL packages are relatively large and heavy and on the other hand accelerometers require as accurate positioning as possible. For this reason, it is recommended that different pick up nozzles are tested to find the best one. -
Page 9: Reflow Soldering
9 (17) In the case of double sided SMT assembly, it should be noted that Murata's components are relatively heavy and they should be glued on the PCB if they are located on the bottom side of the PCB during the second solder reflow process. Murata's does not recommend any specific glue for this purpose. -
Page 10: Moisture Sensitivity Level (Msl) Classification
5. If baking is required, devices may be baked for 24 hours at 85°C. Note: Also Tape&Reel materials are applicable for baking at 85°C. Note: Packing materials and procedures according to IPC/JEDEC J-STD-033 Note: Level and body temperature defined by IPC/JEDEC J-STD-020 Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com... -
Page 11: Inspection
Cross-sectioning is a destructive inspection method. An example of a DIL solder joint cross-section is presented in Figure 8. Figure 8. Cross-section of the DIL package lead's solder joint (with eutectic SnPb solder). Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com... -
Page 12: Precautions
Reference test: 1. (1) Variable Frequency Vibration, JEDEC JESD22-B103, 20 Hz to 2 KHz to 20 Hz in >4 minutes, 4X in each orientation, 50 g peak acceleration. Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com Rev. 2... -
Page 13: Chemicals
5.9.6 Air blowing Heavy compressed air blowing directly onto sensor component shall be avoided. Air blowing could be used for example during cleaning of the PCB. Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com Rev. 2... -
Page 14: Esd
- Plasma cleaning with vacuum Rework Guidelines If it becomes necessary to rework a SCC2000 series component, the preferred way to remove the component is by hot air. Use of a hot air rework station with a vacuum chuck, is the preferred method. A key issue in using hot-air is preventing thermal damage to the component or adjacent components. -
Page 15: Instructions For Desoldering And Removing Of Component
Same temperature is used both for Pb-free and SnPb-solder joints, even though SnPb solders melt already below 200ºC. Some temperature adjustment might be needed. Especially if tool head is old and 'dirty' temperature needs to be increased. Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com... - Page 16 Figure 14. Soldering iron and solder braid used for solder removal. Note that the performance and the reliability of the reworked component may have decreased due to the rework operation! Murata does not recommend rework. Murata Electronics Oy SCC2000 series Doc.
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Page 17: Environmental Aspects
Non-Hermetic Solid State Surface Mount Devices (J-STD-020D). Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices (IPC/JEDEC J-STD-033). Murata Electronics Oy reserves all rights to modify this document without prior notice. Murata Electronics Oy SCC2000 series Doc. No. 2845 www.murata.com...
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