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5.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. V oltage higher than the peak will lead
to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
5.3 High bit error rate
There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel
to avoid interference.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）M aintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to
Tsmax）
Time 25℃ to peak temperature
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
Curve feature
Solder paste
M inimum preheating temperature
M aximum preheating temperature
Preheating time
Average rising rate
Liquid phase temperature
Time above liquidus
Peak temperature
Average descent rate
Time of 25 ° C to peak temperature
E73-2G4M04S1D User manual
Sn-Pb Assembly
Pb-Free Assembly
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6℃/second max
6 minutes max
8 minutes max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
8
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