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Desiccant plug
The camera has been baked in an industrial oven in order to
purge the CMOS chip chamber of as much moisture as pos-
sible. This prevents dew from forming as the TEC lowers the
temperature of the chip. However, at the extreme end of the
TEC cooling range, the tiniest amount of moisture may cause
the chip to dew over, and it's impossible to remove 100% of the
atmospheric moisture. Raise the target cooler temperature if
this occurs, and the dew should dissipate, while still being rela-
tively noise free.
We include an external desiccant plug with o-ring if you wish
to try reducing the moisture in the chamber yourself. We do
not recommend using this plug compared with the pre-baked
internal environment of the housing, as the purged interior is
most likely drier than what can be attained with external desic-
cant. However, after many years of use, if you notice the chip
dewing over at higher temperatures, the external plug may help.
Do not remove
this plug unless
necessary for
external desiccant
plug. The factory
seal is the best
moisture purge.
Figure 11a. The desiccant plug. Do not remove the screw plug on
the camera body unless you specifically want to use the external
desiccant plug. b. The desiccant plug installed in the port. Wait 24
hours for best moisture reduction.
Remove the cap to the desiccant plug (Figure 11a) and insert
a small fragment of a cotton ball all the way into the plug. The
hole inside the plug is very small but it's best to add cotton, as
you don't want desiccant balls falling into the internal camera
chamber! Once the bit of cotton is inserted fully, fill the canister
with dry desiccant balls and cap it shut. Remove the camera
chamber plug cap screw from the camera (Figure 11a), and
install the desiccant plug into the threaded hole (Figure 11b).
It will probably take 24 hours to dry the chamber out as much as
the desiccant will allow.
10
Specifications
Sensor:
Resolution:
Pixel Size:
Diagonal size of chip:
Bayer Matrix pattern:
Exposure range:
Shutter: Rolling Shutter
Partial frame download:
Binning:
ADC:
QE peak:
Read Noise:
Full Well:
Image Buffer:
Interface:
Front nozzle threads:
CMOS chip window:
Dimensions:
Weight:
Back Focus:
Cooling:
Camera electronic power:
Cooler power:
Sony IMX 294 color CMOS,
4/3 format
Up to 4128x2808
4.63 microns
23.1mm
RGGB arrangement
0.1ms – 1000s
Region of interest and Sub-
frame download supported
1x1, 2x2, 3x3, 4x4 hardware
and software binning
14 bit
76%
1.12e@HCG Mode
66.6ke
512mb memory buffer
USB3.0/USB 2.0
42mm T-threads
IR blocking, 380-690nm
spectral range bandpass
80mm x 103mm
535g
17.5mm
Regulated Two Stage TEC,
~35 deg C from ambient
DC 5v from PC USB port
12v/3a
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