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Summary of Contents for March PX-500
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Plasma Asher: March PX-500 User guide (May-30, 2017) This is a highly versatile plasma etch tool that can etch using a direct plasma configuration (Oxygen plasma cleaner), a downstream plasma (Remote plasma), and a directional plasma (Reactive Ion Etch). We supply Oxygen (gas 1) and Argon (gas 2) for use.
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Shelf configuration GROUND RIE PLASMA 1 POWER DIRECT PLASMA GROUND RIE PLASMA 2 POWER DOWNSTREAM FLOAT Program #9 is set for chamber cleaning. User can modify the other programs (#1-#8) For RIE plasma(Directional): Ground shelf upper then power shelf bottom with samples on the power shelf.
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For Direct plasma: Power shelf upper then ground shelf bottom with samples on the ground shelf. Floating not used. Pressure should be in the 0.5 - 1T range. This is a less aggressive etch but does include ions but ions are not necessarily directed towards the samples. The plasma is anisotropic.
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Tool Operation 1) Log on to the FOM 2) LOAD THE SUBSTRATE Press the “MAN OP” button and then press the “BLEED” button to vent the chamber. When the chamber is vented (about 60 s for venting), unlatch the chamber door and insert sample. Put your sample on desired shelf (see shelves configuration above and test result in Appendix...
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LED light. This saves the value. Press the “L DISP” button to light up the “POWER” label. Press the “SET” button to illuminate its LED light Press the “DECR or INCR” buttons to set the plasma power (Watts) by decreasing or increasing the Power in the left display above.
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upper left corner. This starts the process: Chamber is pumped down to 50 millitorr Gas flow is started RF Power is turned on – Note the forward and reflected power values on the RF power supply to the left of the process control module. If the reverse power is more than 50%, shut off the system with the BIG RED EMO button and call a staff member.
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Appendix Chamber Pressure vs Gas Flow Rate Use this chart to decide what approximate gas flow is needed to establish the pressure you need for your plasma. You may have to fine adjust the flow to achieve accurate pressure. As time goes on, the base pump pressure may degrade and shift the lower end of this correlation curve somewhat.
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Actual Flow Rate vs Flow Setting This chart calibrates the flow setting to actual flow in units of Standard Cubic Centimeters per Minute (sccm). The Argon Mass Flow Controller maximum flow is 250 sccm, and the Oxygen meter is 100 sccm – thus the large difference in pressure curves.
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Appendix Ashing Rates for Photomask SC1827 Resist RF Power O2 Flow Ar Flow Pressure Etch Rate Process Plasma type (Ǻ/Min) (Watts) (mTorr) RIE1 1400 Direct plasma RIE2 1200 Downstream RIE1 1300 Direct plasma RIE2 1500 Downstream...
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Appendix Process Controller Module The Process Controller monitors and controls the various parameters of the process. The basic ON/OFF portion of the control panel is shown on the left, and the parameter input and monitor panel is shown on the right. The machine is switched on by pressing the medium sized green button.
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through all 9 possible programs. When a program is selected it is available for execution by the start button. Parameter input is achieved through the 8 buttons in the upper right section of the panel. The term “L DISP” denotes the “Left Display” lights above the buttons. If the “SET”...
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wave into the vacuum diaphragm triggering a calibration drift and possibly causing damage to the gauge. The proper procedure is to open the valve and wait at least 15 seconds before opening the vacuum line to the gauge. RF Power Generator The RF power generator is a separate unit sitting just to the left of the Asher system.
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