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Gemalto Cinterion ELS81-US Hardware Interface Description

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Cinterion
Hardware Interface Description
Version:
01.004
DocId:
els81-us_hid_v01.004
ELS81-US
GEMALTO.COM/M2M

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Summary of Contents for Gemalto Cinterion ELS81-US

  • Page 1 ® Cinterion ELS81-US Hardware Interface Description Version: 01.004 DocId: els81-us_hid_v01.004 GEMALTO.COM/M2M...
  • Page 2 Copyright © 2017, Gemalto M2M GmbH, a Gemalto Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora- tion in the United States and/or other countries.

  • Page 3: Table Of Contents

    ® Page 3 of 107 Cinterion ELS81-US Hardware Interface Description Contents Contents Introduction ......................... 9 Key Features at a Glance .................. 9 ELS81-US System Overview ................12 Circuit Concept ....................13 Interface Characteristics ..................15 Application Interface ..................15 2.1.1 Pad Assignment..................
  • Page 4 ® Page 4 of 107 Cinterion ELS81-US Hardware Interface Description Contents 3.2.2.1 Restart ELS81-US via AT+CFUN Command ...... 59 3.2.2.2 Restart ELS81-US Using EMERG_RST ......60 3.2.3 Signal States after Startup ..............61 3.2.4 Turn off ELS81-US................62 3.2.4.1 Switch off ELS81-US Using AT Command ......62 3.2.5 Automatic Shutdown ................
  • Page 5 ® Page 5 of 107 Cinterion ELS81-US Hardware Interface Description Contents Regulatory and Type Approval Information ............93 Directives and Standards................. 93 SAR requirements specific to portable mobiles ..........96 Reference Equipment for Type Approval ............97 Compliance with FCC and IC Rules and Regulations ........98 Document Information....................
  • Page 6 ® Page 6 of 107 Cinterion ELS81-US Hardware Interface Description Tables Tables Table 1: Pad assignments.................... 16 Table 2: Signal properties .................... 17 Table 3: Absolute maximum ratings................23 Table 4: Signals of the SIM interface (SMT application interface) ....... 30 Table 5: GPIO lines and possible alternative assignment..........
  • Page 7 ® Page 7 of 107 Cinterion ELS81-US Hardware Interface Description Figures Figures Figure 1: ELS81-US system overview................12 Figure 2: ELS81-US block diagram................13 Figure 3: ELS81-US RF section block diagram............. 14 Figure 4: Numbering plan for connecting pads (bottom view)........15 Figure 5: USB circuit .....................
  • Page 8 ® Page 8 of 107 Cinterion ELS81-US Hardware Interface Description Figures Figure 51: Moisture barrier bag (MBB) with imprint............89 Figure 52: Moisture Sensitivity Label ................90 Figure 53: Humidity Indicator Card - HIC ................ 91 Figure 54: Tray dimensions..................... 92 Figure 55: Reference equipment for Type Approval ............

  • Page 9: Introduction

    PS data rate – 384 kbps DL / 384 kbps UL CS data rate – 64 kbps DL / 64 kbps UL 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu- mentation delivered with your Gemalto M2M product. els81-us_hid_v01.004 2017-09-27 ...
  • Page 10 Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment Software AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M AT commands for RIL compatibility Java™ Open Platform Java™ Open Platform with • Java™ profile IMP-NG & CLDC 1.1 HI •...
  • Page 11 DSB75. DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS81-US evalu- ation module to the DSB75.

  • Page 12: Els81-Us System Overview

    ® Page 12 of 107 Cinterion ELS81-US Hardware Interface Description 1.2 ELS81-US System Overview ELS81-US System Overview Application GPIO Module GPIO interface Status DAC (PWM) Fast Fast shutdown shutdown Serial interface/ ASC1/SPI SPI interface COUNTER Pulse counter Serial modem ASC0 lines interface lines/ SPI interface Serial modem...

  • Page 13: Circuit Concept

    ® Page 13 of 107 Cinterion ELS81-US Hardware Interface Description 1.3 Circuit Concept Circuit Concept Figure 2 Figure 3 show block diagrams of the ELS81-US module and illustrate the major functional components: BATT+ V180 LDOs ON circuit LDOs EMERG _RST Reset_BB FST_SHDWN I2CCLK...

  • Page 14: Figure 3: Els81-Us Rf Section Block Diagram

    ® Page 14 of 107 Cinterion ELS81-US Hardware Interface Description 1.3 Circuit Concept PA DCDC BATT+ SKY87000 LTE / UMTS RF transceiver RX/TX SKY77622 RF control SKY13525 B2_OUT TQ_H 4G_HB_IN B4_OUT TP_H 2G/3G_HB_IN TQ_L 4G_LB_IN B5_OUT TP_L 2G/3G_LB_IN B12_OUT Coupler Antenna Band2 RX_M1...

  • Page 15: Interface Characteristics

    ® Page 15 of 107 Cinterion ELS81-US Hardware Interface Description 2 Interface Characteristics Interface Characteristics ELS81-US is equipped with an SMT application interface that connects to the external applica- tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface.

  • Page 16: Table 1: Pad Assignments

    ® Page 16 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface Table 1: Pad assignments Pad no. Signal name Pad no. Signal name Pad no. Signal name Not connected GPIO22 USB_DN Not connected GPIO21 Not connected GPIO23 Not connected BATT+ I2CDAT I2CCLK...

  • Page 17: Signal Properties

    ® Page 17 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.2 Signal Properties Table 2: Signal properties Function Signal name Signal form and level Comment Power BATT+ WCDMA activated: Lines of BATT+ and GND supply BATT+ max = 4.5V must be connected in norm = 3.8V parallel for supply pur-...
  • Page 18 ® Page 18 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface Table 2: Signal properties Function Signal name Signal form and level Comment ≈ ≈ Emer- EMERG_RST 1kΩ, C This line must be driven gency max = VDDLP max low by an open drain or restart min = 1.35V...
  • Page 19 ® Page 19 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface Table 2: Signal properties Function Signal name Signal form and level Comment Serial RXD1 max = 0.25V at I = 1mA If unused keep line open. Interface min = 1.55V at I = -1mA TXD1 ASC1...
  • Page 20 ® Page 20 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface Table 2: Signal properties Function Signal name Signal form and level Comment 1.8V SIM CCRST max = 0.25V at I = 1mA Maximum cable length or Card Inter- min = 1.45V at I = -1mA copper track to SIM card face...
  • Page 21 ® Page 21 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface Table 2: Signal properties Function Signal name Signal form and level Comment SPI_CLK If lines are unused keep max = 0.25V at I = 1mA lines open. min = 1.55V at I = -1mA MOSI max = 1.85V...
  • Page 22 ® Page 22 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface Table 2: Signal properties Function Signal name Signal form and level Comment PWM1 max = 0.25V at I = 1mA If unused keep lines min = 1.55V at I = -1mA open.

  • Page 23: Absolute Maximum Ratings

    ® Page 23 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 3 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to ELS81-US. Table 3: Absolute maximum ratings Parameter Unit...

  • Page 24: Usb Interface

    ® Page 24 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.3 USB Interface ELS81-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data in- terface and for downloading firmware.

  • Page 25: Reducing Power Consumption

    ® Page 25 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.3.1 Reducing Power Consumption While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power.

  • Page 26: Serial Interface Asc0

    ® Page 26 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.4 Serial Interface ASC0 ELS81-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28.

  • Page 27: Figure 7: Asc0 Startup Behavior

    ® Page 27 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface The following figure shows the startup behavior of the asynchronous serial interface ASC0. Power supply active Start up Reset Firmware Command interface Interface state initialization initialization active VCORE V180 EMERG_RST...

  • Page 28: Serial Interface Asc1

    ® Page 28 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.5 Serial Interface ASC1 Four ELS81-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling.

  • Page 29: Figure 9: Asc1 Startup Behavior

    ® Page 29 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface The following figure shows the startup behavior of the asynchronous serial interface ASC1. Power supply active Start up Reset Firmware Command interface Interface state initialization initialization active VCORE V180 EMERG_RST...

  • Page 30: Uicc/Sim/Usim Interface

    To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to op- erate with ELS81-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1...

  • Page 31: Figure 10: External Uicc/Sim/Usim Card Holder Circuit

    ® Page 31 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC 220nF CCRST CCIO CCCLK Figure 10: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS81-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.

  • Page 32: Enhanced Esd Protection For Sim Interface

    ® Page 32 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes to the SIM interface lines as shown in the example given in Figure The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: ±...

  • Page 33: Rtc Backup

    ® Page 33 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.7 RTC Backup The internal Real Time Clock of ELS81-US is supplied from a separate voltage regulator in the power supply component which is also active when ELS81-US is in Power Down mode and BATT+ is available.

  • Page 34: Gpio Interface

    ® Page 34 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.8 GPIO Interface ELS81-US offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.13.4), status LED (see Section 2.1.13.1), the PWM functionality (see Section...

  • Page 35: Figure 13: Gpio Startup Behavior

    ® Page 35 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface The following figure shows the startup behavior of the GPIO interface. With an active state of the ASC0 interface (i.e. CTS0 is at low level) the initialization of the GPIO interface lines is also finished.

  • Page 36: C Interface

    ® Page 36 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.9 C Interface C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con- sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g.

  • Page 37: Figure 15: I 2 C Startup Behavior

    ® Page 37 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface The following figure shows the startup behavior of the I C interface. With an active state of the ASC0 interface (i.e. CTS0 is at low level) the initialization of the I C interface is also finished.

  • Page 38: Spi Interface

    ® Page 38 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.10 SPI Interface Four ELS81-US GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS81-US and the external application.

  • Page 39: Pwm Interfaces

    ® Page 39 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.11 PWM Interfaces The GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interface lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzz- ers.

  • Page 40: Power Indication Circuit

    ® Page 40 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.13.2 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not ex- ceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might cause permanent damage to the module.

  • Page 41: Fast Shutdown

    ® Page 41 of 107 Cinterion ELS81-US Hardware Interface Description 2.1 Application Interface 2.1.13.4 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con- figured FST_SHDN line is an active low control signal and must be applied for at least 1 milli- seconds.

  • Page 42: Rf Antenna Interface

    ® Page 42 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface RF Antenna Interface The ELS81-US UMTS/LTE antenna interface comprises a UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality .
  • Page 43 ® Page 43 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface Table 8: RF Antenna interface UMTS/LTE (at operating temperature range Parameter Conditions Min. Typical Max. Unit LTE 700 Band 12 (ch. band- RF Power @ ARP with 50Ω width 5MHz;...

  • Page 44: Antenna Installation

    ® Page 44 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface 2.2.2 Antenna Installation The antenna is connected by soldering the antenna pad (ANT_MAIN or ANT_DRX) and its neighboring ground pads (GND) directly to the application’s PCB. The antenna pads are the antenna reference points (ARP) for ELS81-US.

  • Page 45: Rf Line Routing Design

    ® Page 45 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from...

  • Page 46: Figure 22: Micro-Stripline On 1.0Mm Standard Fr4 2-Layer Pcb - Example 1

    ® Page 46 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface Micro-Stripline This section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa- tion).

  • Page 47: Figure 23: Micro-Stripline On 1.0Mm Standard Fr4 Pcb - Example 2

    ® Page 47 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface Application board Ground line Antenna line Ground line Figure 23: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 48: Figure 24: Micro-Stripline On 1.5Mm Standard Fr4 Pcb - Example 1

    ® Page 48 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface • Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa- tion). Application board Ground line Antenna line Ground line Figure 24: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1...

  • Page 49: Figure 25: Micro-Stripline On 1.5Mm Standard Fr4 Pcb - Example 2

    ® Page 49 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface Application board Ground line Antenna line Ground line Figure 25: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 50: Routing Example

    ® Page 50 of 107 Cinterion ELS81-US Hardware Interface Description 2.2 RF Antenna Interface 2.2.3.2 Routing Example Interface to RF Connector Figure 26 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial antenna connector. Please note that the ELS81-US bottom plane appears mirrored, since it is viewed from ELS81-US top side.

  • Page 51: Sample Application

    ® Page 51 of 107 Cinterion ELS81-US Hardware Interface Description 2.3 Sample Application Sample Application Figure 27 shows a typical example of how to integrate a ELS81-US module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines.

  • Page 52: Figure 27: Schematic Diagram Of Els81-Us Sample Application

    ® Page 52 of 107 Cinterion ELS81-US Hardware Interface Description 2.3 Sample Application Main antenna VDDLP ANT_MAIN For switch on circuit see Section 3.2.1 Diversity antenna EMERG_RST ANT_DRX 100k RESET 33pF VDDLP 150µF, Low ESR! V180 BATT+ PWR_IND VCORE BEAD* BATT+ Power supply 100k...

  • Page 53: Sample Level Conversion Circuit

    ® Page 53 of 107 Cinterion ELS81-US Hardware Interface Description 2.3 Sample Application 2.3.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application ELS81-US‘s digital input and output lines (i.e., ASC0, ASC1 and GPIO lines) may require level conversion. The following Fig- ure 28 shows a sample circuit with recommended level shifters for an external application‘s mi-...

  • Page 54: Operating Characteristics

    ® Page 54 of 107 Cinterion ELS81-US Hardware Interface Description 3 Operating Characteristics Operating Characteristics Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 9: Overview of operating modes Mode Function Normal UMTS / HSPA / Power saving set automatically when no call is in progress and the USB operation...

  • Page 55: Power Up/Power Down Scenarios

    ® Page 55 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios Power Up/Power Down Scenarios In general, be sure not to turn on ELS81-US while it is beyond the safety limits of voltage and temperature stated in Section 2.1.2.1.

  • Page 56: Figure 29: Sample Circuit For Applying Power Using An External Μc

    ® Page 56 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios IRML6401 3.8V VBATT_IN VBATT Module controller Place C2-C5 close to module µ ENABLE BC847 100k Figure 29: Sample circuit for applying power using an external µC els81-us_hid_v01.004 2017-09-27 ...

  • Page 57: Switch On Els81-Us Using On Signal

    ® Page 57 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios 3.2.1.2 Switch on ELS81-US Using ON Signal After the operating voltage BATT+ is applied, ELS81-US can be switched on by means of the ON signal. The ON signal is an edge triggered signal and allows the input voltage level up to 5V.

  • Page 58: Automatic Power On

    ® Page 58 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios >100ms BATT+ VDDLP Rising edge only starts up the module VCORE V180 EMERG_RST Figure 31: ON timing 3.2.1.3 Automatic Power On If an automatic power on function is required for module application, circuit shown in either Figure 32 Figure 33 is recommended.

  • Page 59: Restart Els81-Us

    ® Page 59 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios VDDLP 0.1μF Voltage Detector* BATT+ Input RESET Output * It is recommended to apply the ultra-low current voltage detector NCP303LSN28T1 manufactured by ON Semiconductor. Details please refer to www.onsemi.com Figure 33: Automatic ON circuit based on voltage detector - option 2 3.2.2 Restart ELS81-US...

  • Page 60: Restart Els81-Us Using Emerg_Rst

    ® Page 60 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios 3.2.2.2 Restart ELS81-US Using EMERG_RST The EMERG_RST signal is internally connected to the main module processor. A low level for more than 10ms sets the processor and with it all the other signal pads to their respective reset state.

  • Page 61: Signal States After Startup

    ® Page 61 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios 3.2.3 Signal States after Startup Table 10 lists the states each interface signal passes through during reset phase and the first firmware initialization. For further firmware startup initializations the values may differ because of different GPIO line configurations.

  • Page 62: Turn Off Els81-Us

    ® Page 62 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios 3.2.4 Turn off ELS81-US To switch the module off the following procedures may be used: • Software controlled shutdown procedure : Software controlled by sending an AT command over the serial application interface.

  • Page 63: Figure 35: Switch Off Behavior

    ® Page 63 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios AT^SMSO System power down procedure Power down BATT+ VDDLP VCORE V180 EMERG_RST Figure 35: Switch off behavior els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 64: Automatic Shutdown

    ® Page 64 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs: • ELS81-US board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) •...

  • Page 65: Undervoltage Shutdown

    ® Page 65 of 107 Cinterion ELS81-US Hardware Interface Description 3.2 Power Up/Power Down Scenarios 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage V given in BATT+ Table 2. When the average supply voltage measured by ELS81-US approaches the undervolt- age shutdown threshold (i.e., 0.05V offset) the module will send the following URC: ^SBC: Undervoltage Warning The undervoltage warning is sent only once - until the next time the module is close to the un-...

  • Page 66: Power Saving

    ® Page 66 of 107 Cinterion ELS81-US Hardware Interface Description 3.3 Power Saving Power Saving ELS81-US can be configured to control power consumption: • Using the AT command AT^SPOW it is possible to specify a so-called power saving mode for the module (<mode> = 2; for details on the command see [1]). The module‘s UART inter- faces (ASC0 and ASC1) are then deactivated and will only periodically be activated to be able to listen to network paging messages as described in Section 3.3.1...

  • Page 67: Power Saving While Attached To Lte Networks

    ® Page 67 of 107 Cinterion ELS81-US Hardware Interface Description 3.3 Power Saving Generally, power saving depends on the module’s application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.64 sec- onds or longer than 5.12 seconds.

  • Page 68: Wake-Up Via Rts0

    ® Page 68 of 107 Cinterion ELS81-US Hardware Interface Description 3.3 Power Saving 3.3.3 Wake-up via RTS0 RTS0 can be used to wake up ELS81-US from SLEEP mode configured with AT^SPOW. Assertion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing an external application to almost immediately terminate power saving.

  • Page 69: Power Supply

    ® Page 69 of 107 Cinterion ELS81-US Hardware Interface Description 3.4 Power Supply Power Supply ELS81-US needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: •...

  • Page 70: Table 13: Current Consumption Ratings (Typical Ratings To Be Confirmed)

    ® Page 70 of 107 Cinterion ELS81-US Hardware Interface Description 3.4 Power Supply Table 13: Current consumption ratings (typical ratings to be confirmed) Description Conditions Typical rating Unit @ 1.8V OFF State supply RTC backup @ BATT+ = 0V µA VDDLP current OFF State supply...
  • Page 71 ® Page 71 of 107 Cinterion ELS81-US Hardware Interface Description 3.4 Power Supply Table 13: Current consumption ratings (typical ratings to be confirmed) Description Conditions Typical rating Unit Average LTE sup- SLEEP @ “Paging USB disconnected BATT+ ply current Occasions“ = 256 USB suspended (i.e., sum of BATT+...

  • Page 72: Measuring The Supply Voltage (Vbatt+)

    ® Page 72 of 107 Cinterion ELS81-US Hardware Interface Description 3.4 Power Supply 3.4.2 Measuring the Supply Voltage (V BATT+ To measure the supply voltage V it is possible to define two reference points GND and BATT+ BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the ex- ternal application the module is mounted on.

  • Page 73: Operating Temperatures

    ® Page 73 of 107 Cinterion ELS81-US Hardware Interface Description 3.5 Operating Temperatures Operating Temperatures Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. Table 14: Board temperature Parameter Unit Normal operation...

  • Page 74: Electrostatic Discharge

    Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Gemalto reference application described in Chapter 3.6.1...

  • Page 75: Blocking Against Rf On Interface Lines

    Figure 41: EMI circuits Note: In case the application uses an internal RF antenna that is implemented close to the ELS81-US module, Gemalto strongly recommends sufficient EMI measures, e.g. of type B or C, for each digital input or output.

  • Page 76: Table 16: Emi Measures On The Application Interface

    ® Page 76 of 107 Cinterion ELS81-US Hardware Interface Description 3.7 Blocking against RF on Interface Lines The following table lists for each signal line at the module‘s SMT application interface the EMI measures that may be implemented. Table 16: EMI measures on the application interface Signal name EMI measures Remark...

  • Page 77: Reliability Characteristics

    ® Page 77 of 107 Cinterion ELS81-US Hardware Interface Description 3.8 Reliability Characteristics Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 17: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20Hz;...

  • Page 78: Mechanical Dimensions, Mounting And Packaging

    ® Page 78 of 107 Cinterion ELS81-US Hardware Interface Description 4 Mechanical Dimensions, Mounting and Packaging Mechanical Dimensions, Mounting and Packaging Mechanical Dimensions of ELS81-US Figure 42 shows the top and bottom view of ELS81-US and provides an overview of the board's mechanical dimensions.

  • Page 79: Figure 43: Dimensions Of Els81-Us (All Dimensions In Mm)

    ® Page 79 of 107 Cinterion ELS81-US Hardware Interface Description 4.1 Mechanical Dimensions of ELS81-US Figure 43: Dimensions of ELS81-US (all dimensions in mm) els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 80: Mounting Els81-Us Onto The Application Platform

    SMT PCB Assembly 4.2.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Gemalto characterizations for lead-free solder paste on a four-layer test PCB and a respectively 110 µm and 150 µm thick stencil.

  • Page 81: Figure 45: Recommended Design For 110Μm Thick Stencil (Top View)

    ® Page 81 of 107 Cinterion ELS81-US Hardware Interface Description 4.2 Mounting ELS81-US onto the Application Platform The central ground pads are primarily intended for stabilizing purposes, and may show some more voids than the application interface pads at the module's rim. This is acceptable, since they are electrically irrelevant.

  • Page 82: Board Level Characterization

    ELS81-US comprises components that are susceptible to damage induced by absorbed mois- ture. Gemalto M2M’s ELS81-US module complies with the latest revision of the IPC/JEDEC J-STD- 020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.

  • Page 83: Soldering Conditions And Temperature

    ® Page 83 of 107 Cinterion ELS81-US Hardware Interface Description 4.2 Mounting ELS81-US onto the Application Platform 4.2.3 Soldering Conditions and Temperature 4.2.3.1 Reflow Profile Smax Smin Preheat Time t to maximum Figure 47: Reflow Profile els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 84: Maximum Temperature And Duration

    ® Page 84 of 107 Cinterion ELS81-US Hardware Interface Description 4.2 Mounting ELS81-US onto the Application Platform Table 18: Reflow temperature ratings Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (T 150°C Smin Temperature Maximum (T 200°C Smax Time (t to t ) (t 60-120 seconds...

  • Page 85: Durability And Mechanical Handling

    ® Page 85 of 107 Cinterion ELS81-US Hardware Interface Description 4.2 Mounting ELS81-US onto the Application Platform 4.2.4 Durability and Mechanical Handling 4.2.4.1 Storage Conditions ELS81-US modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags.

  • Page 86: Processing Life

    ® Page 86 of 107 Cinterion ELS81-US Hardware Interface Description 4.2 Mounting ELS81-US onto the Application Platform 4.2.4.2 Processing Life ELS81-US must be soldered to an application within 72 hours after opening the moisture bar- rier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%.

  • Page 87: Packaging

    ® Page 87 of 107 Cinterion ELS81-US Hardware Interface Description 4.3 Packaging Packaging 4.3.1 Tape and Reel The single-feed tape carrier for ELS81-US is illustrated in Figure 48. The figure also shows the proper part orientation. The tape width is 44mm and the ELS81-US modules are placed on the tape with a 32-mm pitch.

  • Page 88: Barcode Label

    ® Page 88 of 107 Cinterion ELS81-US Hardware Interface Description 4.3 Packaging 4.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 50: Barcode label on tape reel els81-us_hid_v01.004 2017-09-27 ...

  • Page 89: Shipping Materials

    ® Page 89 of 107 Cinterion ELS81-US Hardware Interface Description 4.3 Packaging 4.3.2 Shipping Materials ELS81-US is distributed in tape and reel carriers. The tape and reel carriers used to distribute ELS81-US are packed as described below, including the following required shipping materials: •...

  • Page 90: Figure 52: Moisture Sensitivity Label

    ® Page 90 of 107 Cinterion ELS81-US Hardware Interface Description 4.3 Packaging Figure 52: Moisture Sensitivity Label els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 91: Transportation Box

    ® Page 91 of 107 Cinterion ELS81-US Hardware Interface Description 4.3 Packaging MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture.

  • Page 92: Trays

    ® Page 92 of 107 Cinterion ELS81-US Hardware Interface Description 4.3 Packaging 4.3.3 Trays If small module quantities are required, e.g., for test and evaluation purposes, ELS81-US may be distributed in trays (for dimensions see Figure 54). The small quantity trays are an alterna- tive to the single-feed tape carriers normally used.

  • Page 93: Els81-Us_Hid_V01.004

    ® Page 93 of 107 Cinterion ELS81-US Hardware Interface Description 5 Regulatory and Type Approval Information Regulatory and Type Approval Information Directives and Standards ELS81-US is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec- ifications provided in the "ELS81-US Hardware Interface Description”.

  • Page 94: Table 23: Requirements Of Quality

    Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description. Please see Table 25...

  • Page 95: Table 25: Toxic Or Hazardous Substances Or Elements With Defined Concentration Limits

    ® Page 95 of 107 Cinterion ELS81-US Hardware Interface Description 5.1 Directives and Standards Table 25: Toxic or hazardous substances or elements with defined concentration limits els81-us_hid_v01.004 2017-09-27  Confidential / Preliminary...

  • Page 96: Sar Requirements Specific To Portable Mobiles

    ® Page 96 of 107 Cinterion ELS81-US Hardware Interface Description 5.2 SAR requirements specific to portable mobiles SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a UMTS mod- ule must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS81-US based applications to be evaluated and approved for compliance with national and/or international regulations.

  • Page 97: Reference Equipment For Type Approval

    ELS81-US Hardware Interface Description 5.3 Reference Equipment for Type Approval Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve ELS81-US (including a special approval adapter for the DSB75) is shown in the following figure LTE / GPRS / UMTS Base Station...

  • Page 98: Compliance With Fcc And Ic Rules And Regulations

    ELS81-US Hardware Interface Description 5.4 Compliance with FCC and IC Rules and Regulations Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application de- scribed in Section 5.3 will be registered under the following identifiers:...
  • Page 99 ® Page 99 of 107 Cinterion ELS81-US Hardware Interface Description 5.4 Compliance with FCC and IC Rules and Regulations If Canadian approval is requested for devices incorporating ELS81-US modules the below notes will have to be provided in the English and French language in the final user documen- tation.

  • Page 100: Document Information

    ® Page 100 of 107 Cinterion ELS81-US Hardware Interface Description 6 Document Information Document Information Revision History ® New document: "Cinterion ELS81-US Hardware Interface Description" Version 01.004 Chapter What is new Initial document setup. Related Documents ELS81-US AT Command Set ELS81-US Release Note Application Note 48: SMT Module Integration Application Note 40: Thermal Solutions...
  • Page 101 Description Clear to Send Digital-to-Analog Converter dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Gemalto M2M module) Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, UMTS...
  • Page 102 ® Page 102 of 107 Cinterion ELS81-US Hardware Interface Description 6.3 Terms and Abbreviations Abbreviation Description Mobile Originated Mobile Station (UMTS module), also referred to as TE MSISDN Mobile Station International ISDN number Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol PBCCH...
  • Page 103 ® Page 103 of 107 Cinterion ELS81-US Hardware Interface Description 6.3 Terms and Abbreviations Abbreviation Description TDMA Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction UART Universal asynchronous receiver-transmitter Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR...

  • Page 104: Safety Precaution Notes

    Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions.

  • Page 105: Appendix

    Sales contacts are listed in Table 1. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding. els81-us_hid_v01.004 2017-09-27 ...

  • Page 106: Table 27: Molex Sales Contacts (Subject To Change)

    ® Page 106 of 107 Cinterion ELS81-US Hardware Interface Description 7.1 List of Parts and Accessories Table 27: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH American Headquarters For further information please click: Otto-Hahn-Str. 1b Lisle, Illinois 60532 http://www.molex.com 69190 Walldorf U.S.A.
  • Page 107 About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. ® We work closely with global mobile network operators to ensure that Cinterion modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment.

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