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Bachmann IPC1419 Operating Instructions Manual

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Operating instructions
IPC1419
Version:
05
Status:
September 14, 2010
Translation of the original operating instructions

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Summary of Contents for Bachmann IPC1419

  • Page 1 Operating instructions IPC1419 Version: Status: September 14, 2010 Translation of the original operating instructions...
  • Page 2 Bachmann electronic GmbH prior written consent has been obtained. All further rights in Bachmann-software are specified in the "End User Licence Agreement" (EULA). Where a reference is made to products and/or services from third-parties in this manual, this is done only for the purpose of example or is a mere recommendation from Bachmann electronic GmbH.

  • Page 3: Table Of Contents

    Table of Contents Table of Contents 1 Structure of safety and warning notices................OI-1 2 Safety instructions ........................OI-3 2.1 General.............................OI-3 2.2 Target group.............................OI-3 2.3 Intended use.............................OI-4 2.4 Electrical connection ........................OI-4 2.5 Operation............................OI-5 2.6 CE Directives............................OI-5 2.7 ESD protection ..........................OI-6 3 Device configuration, system description ................
  • Page 4 Table of Contents 6.7 Shut-down............................OI-40 7 Technical data and dimensional drawings ................. OI-41 7.1 Interference resistance, UL approval .................... OI-41 7.1.1 CE compliance ........................OI-41 7.1.2 UL approval ........................OI-42 7.2 Technical data ..........................OI-43 7.3 Dimensional drawings ........................OI-46 V05 / September 14, 2010...

  • Page 5: Structure Of Safety And Warning Notices

    D-BA-0000255.6.3 Operating instructions Structure of safety and warning notices 1 Structure of safety and warning notices This documentation contains safety and warning notices, indicating potential dangers and possible personal injury or damage to hardware and software. These warnings are structured as follows: WARNING Type and source of danger.
  • Page 6 D-BA-0000255.6.3 Structure of safety and warning notices Operating instructions OI-2 V05 / September 14, 2010...

  • Page 7: Safety Instructions

    In the event that something is unclear or if additional information is required, please contact your technical service representative at Bachmann electronic GmbH. 2.1 General Never install or operate damaged products. Please report any defects immediately to the carrier.

  • Page 8: Intended Use

    D-BA-0000303.5.2 Safety instructions Operating instructions 2.3 Intended use The device was designed for installation in the front of switch cabinets of machine and system technology. The operator must ensure that • the device is only used for its intended purpose. •...

  • Page 9: Operation

    2.6 CE Directives Bachmann electronic GmbH calls attention to the fact that CE compliance has to be verified again when working on assemblies or modules. V05 / September 14, 2010...

  • Page 10: Esd Protection

    D-BA-0000303.5.2 Safety instructions Operating instructions 2.7 ESD protection ESD: Electrostatic Discharge ESDS: Electrostatic Discharge Sensitive ATTENTION Electrostatic discharge. Components may be destroyed. • Consider protective measures for ESD. Correctly assembled ESDS devices are protected against ESD Unassembled ESDS devices, particularly the interior parts (e.g. the mother board), can be damaged on contact due to ESD.

  • Page 11: Device Configuration, System Description

    (rack units) that are stacked on top of each other. The Rack unit connectsthe CPU module with the display module. The implementation of knowledge from Bachmann electronic GmbH in this device provides a high degree of reliability and flexibility with a variety of application possibilities.

  • Page 12: Type Plate, Customer Label

    3.1 Type plate, customer label Type plate The type plate contains most important product specifications of the device. • Ord.Nr. (Ordering number)  Table 23 ''Device equipment / Order number IPC1419'', Page OI-43 • Model (Product name) • Type (Equipment) ...

  • Page 13: Cpu Module

    1 x COM 1 RS232/422 (switchable, RS232C or reduced) 1 x COM 2 RS232C complete signal set 1 x PS/2 (keyboard and mouse via Y-adapter) Mic, Line-In, Line-Out Status LED PWR, HDD, DIAG Tab. 2: Device equipment of IPC1419 V05 / September 14, 2010 OI-9...

  • Page 14: Interfaces

    D-BA-0000304.14.5 Device configuration, system description Operating instructions 3.2.2 Interfaces Fig. 5: Interfaces I Status LED (PWR, HDD, DIAG)  Table 18, Page OI-34 Hex rotary switches VGA connector Power supply fuse Fig. 6: Interfaces II Supply voltage Parallel port (LPT) Serial interfaces USB interfaces CF card slot...
  • Page 15 RS232 with a reduced signal set or RS422. The interface is factory set as a complete RS232. The switch between "complete" and "reduced" is made by means of a DIP switches (only possible by Bachmann electronic GmbH). D-Sub 9 pin (male) Signal...
  • Page 16 D-BA-0000304.14.5 Device configuration, system description Operating instructions COM 2 – RS232C The serial interface COM 2 is provided as a complete RS232C. D-Sub 9 pin (male) Signal Description Data Carrier Detect Receive Data Transmit Data Data terminal ready Ground Data Set Ready Request to Send Clear to Send Ring Indicator...
  • Page 17 D-BA-0000304.14.5 Operating instructions Device configuration, system description 3.2.2.3 Power USB The interface is used to connect USB users with a current draw of > 500 mA and a power consumption of ≤ 8 watts that cannot be operated using the standard USB interface.
  • Page 18 D-BA-0000304.14.5 Device configuration, system description Operating instructions 3.2.2.5 Ethernet RJ45 (10/100Base-T) RJ45 Signal Description TxD+ Transmit Data + TxD- Transmit Data - RxD+ Receive Data + n. c. not connected RxD- Receive Data - n. c. not connected Tab. 9: Pin assignment for Ethernet socket LED Status Description Connected to the 100Mbit network...
  • Page 19 D-BA-0000304.14.5 Operating instructions Device configuration, system description 3.2.2.7 Power supply The connector for the supply voltage must be tightened with a torque of 0.5 to 0.6 Nm (UL508: 5 to 7 in lbs). A 6 pin connector is provided for the +24 VDC supply of the device. 3 poles are used for the supply voltage (+24 VDC, GND, functional ground), and the remaining 3 poles are used for an external optional key button (NO contact between Pin 6 and 5) and for a key switch (NO contact between Pin 4 and 5) for...
  • Page 20 Improper replacement or bridging of fuse • Use fuse type KFZ Fuse 15A/80V 19x19.7x5mm UL248. Alternative fuse types may be requested at Bachmann electronic GmbH. This converts the input voltage (24 VDC) into the voltages which are required for the operation of the hardware components.
  • Page 21 D-BA-0000304.14.5 Operating instructions Device configuration, system description 3.2.2.9 LPT D-Sub 25 pin (female) Signal Description PSTB Strobe out PPD0 Port data bit 0 PPD1 Port data bit 1 PPD2 Port data bit 2 PPD3 Port data bit 3 PPD4 Port data bit 4 PPD5 Port data bit 5 PPD6...
  • Page 22 D-BA-0000304.14.5 Device configuration, system description Operating instructions 3.2.2.10 VGA connector The signal of the VGA connector may be used for separate displays at a distance of ≤ 3 m. For greater distances, an expansion module (DSA or DSA/HDD) must be used for a separate remote video.

  • Page 23: Compactflash Card (Cf Card

    3.3 V and also 5 V types may be used. The corresponding input voltage is automatically selected by the device. Use only cards of Bachmann electronic GmbH or those which have been released. Typical reading-/writing speed File size 20 MB...

  • Page 24: Rack Unit

    D-BA-0000304.14.5 Device configuration, system description Operating instructions 3.3 Rack unit The rack unit is used to expand the base unit using different optional expansion modules. These units can house different hardware components, such as cards (PCI/PCIe) and drives (CD-ROM, DVD, floppy drives). 3.3.1 Versions Zero design If no additional drives or other expansions are required, the system unit is directly...

  • Page 25: Display Module

    D-BA-0000304.14.5 Operating instructions Device configuration, system description 3.4 Display module The Display module contains the display, as well as the control electronics for the display. To increase the lifetime of the display, the active phase of the backlight will be set as short as possible.

  • Page 26: Front Panel Module

    D-BA-0000304.14.5 Device configuration, system description Operating instructions 3.5 Front panel module Fig. 8: Front panel IPC1419 Front panel Display module OI-22 V05 / September 14, 2010...

  • Page 27: Installation

    D-BA-0000305.4.10 Operating instructions Installation 4 Installation 4.1 Transport, storage, unpacking The following instructions for transport, storage and appropriate handling must be observed. Transport In spite of the robust structure, the integrated components are sensitive to severe shock and vibrations. Therefore, protect your device from major mechanical stress while transporting.

  • Page 28: Installation Notes

    D-BA-0000305.4.10 Installation Operating instructions 4.2 Installation notes The ambient conditions must be regard. ( Table 26, Page OI-44) The screws on the D-Sub connectors must be tightened. The switch cabinet wall must be equipped with a sufficient installation cutout for the assembled device according to the device dimensions.

  • Page 29: Installing The Device

    D-BA-0000305.4.10 Operating instructions Installation 4.3 Installing the device Installation in switch cabinet Procedure: Fit the device into the cut-out from the front. Insert the tensioning clamps in the device and fasten them. Fix the tensioning clamps by tightening the Phillips screws with a specified torque of 25 to 30 Ncm.

  • Page 30: Grounding Measures

    D-BA-0000305.4.10 Installation Operating instructions 4.4 Grounding measures Grounding must be carried out carefully and according to regulations in order to ensure the proper function of the device. A low-impedance connection to the ground reduces the danger of an electrical surge in the event of a short circuit or defects in the system. Moreover, correct grounding and shielding of the cables reduce the effects of radiated interference on the system.

  • Page 31: Cables

    For small cable lengths, it is also possible to use cable with a cross-section of ≥ 1.5 mm Copper wires must be used for connection cable with a temperature range of -30 °C to +80 °C. Further information:  Table 26 ''Ambient conditions IPC1419'', Page OI-44 V05 / September 14, 2010 OI-27...

  • Page 32: Shielding Of Signal Cables

    D-BA-0000305.4.10 Installation Operating instructions 4.6 Shielding of signal cables All cables except those used for the supply voltage must be shielded. Cables are shielded to reduce the effects of magnetic, electrical and electro- magnetic interference. Operating principle Interference currents on cable shields are directed to the ground via the housing. To prevent these interference currents from becoming interference sources themselves, an electrically well conductive (low-impedance) connection to the ground is extremely important.

  • Page 33: Potential Equalization

    D-BA-0000305.4.10 Operating instructions Installation 4.7 Potential equalization Differences in the potential may occur between separated parts of the system, which may result in high potential equalization currents, e.g. on a shield connected at both ends, with parts of the system grounded in different ways. The cause for potential differences may be different mains feeds.
  • Page 34 D-BA-0000305.4.10 Installation Operating instructions OI-30 V05 / September 14, 2010...

  • Page 35: Getting Started

    D-BA-0000306.14.2 Operating instructions Getting started 5 Getting started The device is delivered with a pre-installed customer-specific software (BIOS, operating system and all necessary drivers etc.). When installing additional software please refer to the manual provided by the software manufacturer. Requirements Procedure: Check the installation.
  • Page 36 D-BA-0000306.14.2 Getting started Operating instructions OI-32 V05 / September 14, 2010...

  • Page 37: Operation And Service

    D-BA-0000307.7.7 Operating instructions Operation and service 6 Operation and service 6.1 BIOS settings NOTICE Incorrect BIOS settings Device malfunctions • Only make changes to settings if you know the result of doing such. • Check the LCD display to be used before entering the setup settings. •...

  • Page 38: Status Indication

    D-BA-0000307.7.7 Operation and service Operating instructions 6.2 Status indication 6.2.1 CPU module There are 3 LED on the back of the CPU module that light up to indicate different operation modes. Interrelationship between LED activity and operating status DIAG State (green) (red) (green)

  • Page 39: Error Messages And Troubleshooting

    With every malfunction of the device check first if all cables are connected correctly. If malfunctions have occurred that could not be corrected, please contact your technical service representative at Bachmann electronic GmbH. With repairs please state the following: •...
  • Page 40 D-BA-0000307.7.7 Operation and service Operating instructions Operating system does not boot Symptom Cause Help Screen prompt Invalid system No operating system is available Install software. on the CF card. disk USB stick inserted. Remove stick, press any key or restart. Drive not recognized.

  • Page 41: Care

    D-BA-0000307.7.7 Operating instructions Operation and service 6.4 Care During the cleaning don't use any aggressive or abrasive cleansers. Note the protection class of the front panel. ( Table 29, Page OI-45) 6.4.1 Foil or front panel Use a soft cloth to clean these parts. To remove persistent contamination, the cloth can be moisten with a little bit of commercial window cleaner.

  • Page 42: Memory Effect With Tft Displays

    D-BA-0000307.7.7 Operation and service Operating instructions 6.5 Memory effect with TFT displays Operating displays based on TFT technology in continuous in operation and with no or only little content change, may cause so called image sticking. This behavior is influenced by different conditions (e.g. ambient temperature, switch on/off characteristics, number of image changes) so that an exact time of occurrence cannot be specified.

  • Page 43: Device Behavior In The Event Of Overtemperature

    D-BA-0000307.7.7 Operating instructions Operation and service 6.6 Device behavior in the event of overtemperature With excess of the permissible operating temperature, the CPU clock frequency is reduced. If the reduction of the clock frequency is insufficient for a reliable CPU temperature, the CPU clock frequency is further reduced until a reliable CPU temperature is reached.

  • Page 44: Shut-Down

    Remove the device. Storage Use the original packaging for storage and take into account the climatic conditions.  Table 26 ''Ambient conditions IPC1419'', Page OI-44 Disposal The device must be disposed of according to the applicable local environmental regulations for electronic devices.

  • Page 45: Technical Data And Dimensional Drawings

    D-BA-0000308.6.4 Operating instructions Technical data and dimensional drawings 7 Technical data and dimensional drawings 7.1 Interference resistance, UL approval 7.1.1 CE compliance Electromagnetic compatibility EMC The devices are intended as components for installation in machines and systems. Adherence to the installation instructions warrants compliance with the corresponding requirements for CE compliance of the entire machine/system equipped with such components based on the EMC Directive 2004/108/EC.

  • Page 46: Ul Approval

    D-BA-0000308.6.4 Technical data and dimensional drawings Operating instructions 7.1.2 UL approval The devices are certified as components for installation in machines and systems for the American and Canadian market. To keep the UL508, each M-VIS device must be provided with a "UL Listed Class 2 power Supply".

  • Page 47: Technical Data

    Technical data and dimensional drawings 7.2 Technical data Device equipment of Equipment Order number IPC1419/T/BA1/PM1G4/DD1G0/CF8GB/Xpe 00014694-10 Tab. 23: Device equipment / Order number IPC1419 Software ® Operating system Microsoft Windows XP Professional for Embedded Systems Tab. 24: Operating system IPC1419...
  • Page 48 Technical data and dimensional drawings Operating instructions Ambient conditions Operating  Table 27 ''Operating temperature IPC1419'', Page OI temperature Tested according to EN60068-2-14 (test Na and Nb) and UL508 This value refers to an ambient temperature measured at a distance of 10 cm to front, rear, top and bottom side, in quiet air and without exposing the device to any heat radiation.
  • Page 49 The operating temperature may deviate due to the configuration of the device. Tab. 28: Operating temperature IPC1419 Degree of protection CE: IP65 Front UL/cUL: Type 1 Back IP20 Tab. 29: Degree of protection IPC1419 V05 / September 14, 2010 OI-45...

  • Page 50: Dimensional Drawings

    7.3 Dimensional drawings Fig. 10: Dimensions IPC1419 Dimension Weight [mm] A (Width) approx. 12 kg B (Height) 374.6 Depth C (Width) D (Height) E (Offset outline/cut-out) F (Offset outline/cut-out) Tab. 30: Dimensions / Weight IPC1419 OI-46 V05 / September 14, 2010...

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