Table Of Contents - Yamaha YDS-10 Service Manual

YDS-10
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3 7 63 1515 0
I CONTENTS
REAR PANELS .............................................................. 3
SPECIFICATIONS / 参考仕様 ........................................ 3
INTERNAL VIEW ........................................................... 4
REPAIR NOTES / 修理上の留意点 ................................ 4
DISASSEMBLY PROCEDURES / 分解手順 .................. 5
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and
possibly other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REA-
SON WHATSOEVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before
handling food.
About lead free solder / 無鉛ハンダについて
The P.C.B.s installed in this unit are soldered using the
following solder.
TE
L 13942296513
MAIN P.C.B.
Among some types of lead free solder currently available,
it is recommended to use one of the following types for the
repair work.
• Sn + Ag + Cu (tin + silver + copper)
• Sn + Cu (tin + copper)
• Sn + Zn + Bi (tin + zinc + bismuth)
Caution:
1. As the melting point temperature of the lead free solder
is about 30°C to 40°C (50°F to 70°F) higher than that of
the lead solder, be sure to use a soldering iron suitable
to each solder.
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2. If lead solder must be used, be sure to remove lead free
solder from each terminal section of the parts to be
replaced and from the area around it completely before
.
soldering, or make sure that the lead-free solder and
lead solder melt together fully.
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Side A /
Lead Free Solder /
Side A SMT
Solder Dip
Side B MI
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2 9
8
BLOCK DIAGRAM ......................................................... 5
PRINTED CIRCUIT BOARD .......................................... 6
SCHEMATIC DIAGRAM ................................................ 7
REPLACEMENT PARTS LIST ...................................... 9
本機に搭載されている基板のハンダ付けに使用されているハンダ
は下記の通りです。
Q Q
3 6 7 1 3 1 5
Side B /
A 面
Lead Free Solder /
無鉛ハンダ
REFLOW
Process
FLOW
Process
無鉛ハンダにはいくつかの種類がありますが、修理時には下記の
ような無鉛ハンダの使用を推奨します。
・Sn+Ag+Cu （錫+銀+銅）
・Sn+Cu （錫+銅）
・Sn+Zn+Bi （錫+亜鉛+ビスマス）
注意：
1. 無鉛ハンダの融点温度は通常の鉛入りハンダに比べ30~40℃
程度高くなっていますので、それぞれのハンダに合ったハンダ
ごてをご使用ください。
2. 鉛入りハンダを使わざるを得ない場合は、あらかじめ交換する
co
部品端子部やその周辺部の無鉛ハンダをすべて取り除くか、あ
るいは無鉛ハンダと鉛入りハンダが十分に溶けた状態となるよ
.
うにハンダ付けしてください。
9 4 2 8
0 5 8 2 9 9 4 2 8
B 面
無鉛ハンダ
m
9 9
9 9