Related Manuals for Zte MG2618
Summary of Contents for Zte MG2618
- Page 1 Welink Your Smart Hardware Development Guide of Module Product ZTE MG2618 Version 1.0，2015-03-18...
- Page 2 Hardware Development Guide of Module Product Legal Information By accepting this certain document of ZTE CORPORATIN you agree to the following terms. If you do not agree to the following terms, please notice that you are not allowed to use this document.
- Page 3 ZTE MG2618 Hardware Development Guide of Module Product Revision History Version Date Description V1.0 2015-03-18 released All Rights reserved, No Spreading abroad without Permission of ZTE...
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Page 4: Table Of Contents
LED INDICATOR INTERFACE ..................22 GPS INTERFACE ......................22 CONNECTION METHOD OF GPS ACTIVE ANTENNA..........23 MECHANIC FEATURES......................24 APPEARANCE DIAGRAM ..................... 24 ASSEMBLY DIAGRAM ....................25 PCB PACKAGE DIMENSIONS ..................26 All Rights reserved, No Spreading abroad without Permission of ZTE... - Page 5 6.5.6 MAINTENANCE OF DEFECTS ................34 MODULE’S BAKING REQUIREMENTS ............... 35 6.6.1 MODULE’S BAKING ENVIRONMENT .............. 35 6.6.2 BAKING DEVICE AND OPERATION PROCEDURE ........35 6.6.3 MODULE BAKING CONDITIONS ..............35 SAFETY INFORMATION ......................36 All Rights reserved, No Spreading abroad without Permission of ZTE...
- Page 6 Figure 6–4 Green oil and white oil at module’s position on main board ............ 30 Figure 6–5 Module Board’s Steel Mesh Diagram ..................32 Figure 6–6 Material Module Pallet ......................33 Figure 6–7 Module Furnace Temperature Curve Diagram ................. 34 All Rights reserved, No Spreading abroad without Permission of ZTE...
- Page 7 Table 4–5 Definition of LED Indicator Status .................... 22 Table 6–1 Baking parameters ........................28 Table 6–2 Recommended PAD dimensions of main board ................ 30 Table 6–3 LCC module PAD’s steel mesh opening ................... 31 All Rights reserved, No Spreading abroad without Permission of ZTE...
- Page 8 Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. Hereby, ZTE CORPORATION declares that this product is in complies with the essential requirements of Article 3 of the R&TTE 1999/5/EC Directive. All Rights reserved, No Spreading abroad without Permission of ZTE...
- Page 9 1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 3 dBi. 2)The transmitter module may not be co-located with any other transmitter or antenna. All Rights reserved, No Spreading abroad without Permission of ZTE VIII...
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Page 10: Product Overview
GSM 850/900/1800/1900 Support MG2618 is a wireless Internet module with 49 pin LCC interface. It is widely applied to but not limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services, transceiver Email, web browsing, high speed download and so on. -
Page 11: Application Frame
Embedded FTP Support TEXT/PDU mode Point-to-point MO/MT SMS Cell Broadcast AT Commands Static AT commands set Extended AT commands set Application Frame The application frame of module is as follows: All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 12: Abbreviations
绝对射频信道号 Antenna Reference Point 天线参考点 ASIC Application Specific Integrated Circuit 专用集成电路 Bit Error Rate 比特误码率 Base Transceiver Station 基站收发信台 CDMA Code Division Multiple Access 码分多址 CDMA Development Group CDMA 发展组织 All Rights reserved, No Spreading abroad without Permission of ZTE... - Page 13 液晶显示器 Light Emitting Diode 发光二极管 Machine Control Unit 机器控制单元 Man Machine Interface 人机交互接口 / 人机界面 Mobile Station 移动台 Printed Circuit Board 印刷电路板 Power Control Level 功率控制等级 Personal Communication System 个人通讯系统 All Rights reserved, No Spreading abroad without Permission of ZTE...
- Page 14 Terminal Equipment also referred it as DTE 终端设备，也指 DTE TTFF Time To First Fix 首次定位时间 UART Universal asynchronous receiver-transmitter 通用异步接收 / 发送器 User Identifier Management 用户身份管理 Universal Serial Bus 通用串行总线 All Rights reserved, No Spreading abroad without Permission of ZTE...
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Page 15: Interfaces
ZTE MG2618 Hardware Development Guide of Module Product Interfaces The MG2618 module connects externally through a 49 PIN stamp-hole interface. PIN Description Table 2–1 PIN Interface Definition Type Signal Definition Description Remark Working status POWER RSSI_LED Active High indicator Module Valid at low level;... - Page 16 ADC voltage ADCIN detection USB differential Using USB and RI to download USB_DP data (+) firmware, calibration and measurement. Not support data USB differential USB_DM transmitting yet. data (-) All Rights reserved, No Spreading abroad without Permission of ZTE...
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Page 17: Antenna Interface
It’s forbidden to put some interference sources such as DC to DC, WIFI module, SIM card around RF wires or RF port. RF Performance of antenna interface The RF performance of antenna interface is shown in Table 2-2: Table 2–2 RF Performance of antenna interface All Rights reserved, No Spreading abroad without Permission of ZTE... - Page 18 Band Transmitter (MS->BTS) (BTS->MS) Power(dBm) ypical) GSM850 824MHz-849MHz 869MHz-894MHz 33±2 dBm -108dBm EGSM900 880MHz-915MHz 925MHz-960MHz 33±2 dBm -108dBm DCS1800 1710MHz-1785MHz 1805MHz-1880MHz 30±2 dBm -106dBm PCS1900 1850MHz-1910MHz 1930MHz-1990MHz 30±2 dBm -106dBm All Rights reserved, No Spreading abroad without Permission of ZTE...
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Page 19: Electric Features
23.68 27.2 Sleep 28.55 0.93 2.45 Turn on the module, GSP Working current kernel is running, not sleep or 123.44 54.27 72.55 work Network lock current PGSM，62，PCL5 239.4 174.68 242.68 All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 20: Power-On/Off Timing Sequence
The test results must conform to the industrial requirements. Module testing environment of temperature is shown as the Table below. Table 3–3 Module testing environment of temperature All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 21: Esd Characteristic
Cold start Sensitivity(dBm) -145.5 Warm start -159.5 Cold start 34.1 Warm start TTFF @-130 dBm(Sec.) 32.7 Hot start Note: The test result belongs to the modules which support GPS function. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 22: Reference Circuit Of Module Interfaces
CJ2305 from Changjiang Electronics or DMP2305U-7 from DIODES since VT1 is MOS tube. Refer to figure 4-2 for the design of power circuit. Select MIC29302 and adjust the output voltage through All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 23: Figure 4-1 Reference Circuit Of Power Supply & Reset Interface
Figure 4–1 Reference Circuit of Power Supply & Reset Interface Voltage input Power supply for module VBAT /SHUT SENSE 0.1uF 100uF 0.1uF 2.2K 10uF MIC29302 Figure 4–2 Reference Circuit of Power Supply Interface VREG_MSME1 All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 24: Uart Interface
Figure is Schottky diode (forward voltage drop is 0.3V). If you select other diodes, please select one with lower forward voltage drop to make sure RXD_2V8 is below the threshold when inputting low level. Recommended level converter :NLSX5014MUTAG//TXB0304RUTR； Recommended Transistor: MMBT3904LT1G//LMBT3904LT1G//PMBT3904； Recommended Diode: LRB521S-30T1G//RB521SM-30T2R//RB521S-30//1PS79SB10// RB521S-30U9JTE61 All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 25: Figure 4-3 Reference Circuit 1 Of Uart Interface
/DRT pin to low level. 4)When there is a call, a low level is output from PIN RI, and lasting until the end of conversation. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 26: Duplex Uart Interface
DTE transmits serial data UART Carrier detection Data link connected /DSR Data set ready DCE is ready Ringtone indication Inform DTE upon a remote call /DTR Data terminal ready DTE is ready All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 27: Sim Card Interface
Ground pin of the ESD protection component is well connected to the Ground. The recommended model is: CESDLC3V0L4//NZQA5V6AXV5T1G//PESD3V3V4UW. The reference circuit of SIM card interface is as shown in Figure below. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 28: Audio Interface
Differential audio output AUDIO SPK1_P channel 1, anode Single-end audio input MIC2_P Single-end input channel 2 Single-end audio output SPK2_P Single-end output channel 2 HSED BIAS MIC bias Default: 1.8V All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 29: Figure 4-7 Mic Reference Circuit
ZTE MG2618 Hardware Development Guide of Module Product See the audio reference circuit in Figure below. Figure 4–7 MIC reference circuit All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 30: Figure 4-8 Spk Reference Circuit
ESD from damaging the module. 3) Make sure the use environment and module are well grounded and there is no mutual influence. 4) The power ripple supplied to the module is less than 50mV. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 31: Led Indicator Interface
It can’t drive the LED directly, and it need to work with transistor. The figure below is the reference of circuit. Figure 4–9 Reference Circuit of Status Indicator Interface (This chapter can be only applied by the modules support GPS function) All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 32: Connection Method Of Gps Active Antenna
GPS active antenna, connect M_GPS_RF to GPS_ANT, and connect GPS_RFIN to GPS active antenna. The resistance of RF cable in the figure is 50Ω. Figure 4–11 Active GPS antenna circuit reference design principle diagram All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 33: Mechanic Features
Mechanic Features Appearance diagram Figure 5–1 Top & bottom & side view of module (Note: The figure above is just for reference, please take the actual products as the reference) All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 34: Assembly Diagram
Hardware Development Guide of Module Product Assembly Diagram See the assembly diagram of module in Figure below (Unit: mm): Figure 5–2 The assembly diagram of module Dimensions(Length×Width×Thickness): 22.00mm×20.00mm×2.0mm Weight: About 1.9g All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 35: Pcb Package Dimensions
PCB Package Dimensions The PCB package dimensions of module are shown in Figure below (Unit: mm): ←PIN1 PIN18→ ←PIN49 ←PIN37 PIN19→ ←PIN36 Figure 5–3 The PCB package dimensions of module (Top View) All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 36: Figure 5-4 Test Point Of Module
1） Copper-clad and wiring are forbidden in the nearby areas of the RF stamp-hole. 2） For the convenience of testing and maintenance, it is recommended to drill holes on the PCB to expose JTAG test points. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 37: Smt Process And Baking Guide
When in the process of PAD designing of module, refer to IPC-SM-782A and the chapter 6.2 below. Recommended PAD Design When designing the pad of main board, the following dimensions marked in the Figure below should be taken into consideration. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 38: Figure 6-1 Module's Dimensions
Hardware Development Guide of Module Product Figure 6–1 Module’s dimensions Figure 6–2 Recommended PAD dimensions on corresponding main board t1=Main board’s PAD extend outward LCC module t2=Main board’s PAD extend inward All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 39: Requirements Of Module's Position On Main Board
(The figure is just for reference; it doesn’t represent the actual module encapsulation) In addition, do not lay out other components within 2mm around the module’s position on main board to ensure the maintenance of the module. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 40: Module Planeness Standard
3） Requirements on the thickness of solder paste: control the thickness between 0.18mm and 0.20mm. 4） See the LCC module PAD’s steel mesh opening in the following table: Table 6–3 LCC module PAD’s steel mesh opening All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 41: Module Board's Smt Process
6.5.3 SMT Pallets: The pallets, which are suitable for SMT, have been made for most ZTE modules. If the module has provided the pallets itself and meets the SMT requirements, customers can directly use it for module SMT. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 42: Module Soldering Reflow Curve
6.5.4 Module Soldering Reflow Curve Module soldering furnace temperature curve is: Peak value: 245+0/-5℃ ≥217℃: 30～～60S 150～200℃: 60～～120S Temperature rise slope: <3℃/S Temperature drop rate: －2～－4℃/S All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 43: Reflow Method
If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module board and main board, the welder can directly use the soldering iron to repair welding according to the factory’s normal welding parameters. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 44: Module's Baking Requirements
During the baking process, do not overlay the modules directly because it might cause damage to the module’s chipset. 6.6.3 Module Baking Conditions See the baking parameters in Table 6-1. All Rights reserved, No Spreading abroad without Permission of ZTE... -
Page 45: Safety Information
It’s the responsibility of users to enforce other country regulations and the specific environment regulations. And our company does not take on any liability for customer failure to comply with these precautions. All Rights reserved, No Spreading abroad without Permission of ZTE...
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