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Module(MOD800:LBWA1UDBD7-093)
The Wi-Fi Module which uses Philips Chip is manufactured by MuRata. It only supports 802.11b
Specification and communicates with CPU through SPI Interface. The data throughput is up to 11
Mbps in the abstractly but typically supports 4Mbps in the real field.
Modulation method is DSSS(Direct Sequence Spread Spectum).
Its channel spacing is 5MHz and bandwidth is 22 MHz.
⑹
Bluetooth Part
Antenna(C1103LJ)
Antenna receives signal from AP(Access Point) or other devices.
It is a ISM(industrial, Scientific, Medical frequencies) Band Antenna that covers only 2.4 GHz.
Module(U801:BTEZ1702SA)
The Bluetooth Module which uses CSR's BC02-Audio is manufactured by SEMCO. It only supports
802.15 Specification(Bluetooth Specification 1.1) and communicates with CPU through UART Interface.
The data throughput is up to 1 Mbps in the abstractly but typically supports 723 / 57.6 Kbps in an
asynchronous mode and 432.6 kbps in a synchronous mode.
Modulation method is FHSS(Frequency hopping spread spectrum) and it hops 1600 times a second.
Its channel spacing is 1MHz and bandwidth is 1MHz.
⑺
All the Peripherals
Camera
A highly integrated single chip CCD color sensor implemented by 2M CCD sensor process realizing
high sensitivity and wide dynamic range.
Total pixel array size is 1632x1224.
Memory card
The MultiMediaCard Controller on the Intel PXA270 can communicate with either:
● a MultiMediaCard (MMC)
● a Secure Digital (SD) Memory Card
● a Secure Digital I/O (SDIO) Card
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
2-7
Circuit Description
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