Reflow Soldering - Murata GRM Manual

! Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in table 1.
Table 1
Series
GRM/GJM/GQM/GR3/
02/03/15/18/21/31
GRJ/KRM/LLR/NFM/GR7
LLL 02/03/15/18/1U/21/31
ZRB 15/18
GR3/GRJ/GRM/KR3/KRM
32/42/43/52/55
GA2/GA3/GR4
LLA/LLM 18/21/31
GQM 22
Recommended Conditions
Pb-Sn Solder
Peak Temperature 230 to 250°C
Atmosphere
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
3. When a capacitor is mounted at a temperature lower
than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can
occur. Consider factors such as the placement of
peripheral components and the reflow temperature
setting to prevent the capacitor's reflow temperature
from dropping below the peak temperature specified. Be
sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur.
the land patterns of the circuit board
Chip Dimension Code Temperature
(L/W) Differential
ΔT < = 190°C
ΔT < = 130°C
Lead Free Solder
240 to 260°C
Air Air or N
2
[Example of Temperature Conditions for Reflow Soldering]
Temperature (°C)
Peak Temperature
220°C (200°C)
ΔT
190°C (170°C)
170°C (150°C)
150°C (130°C)
Preheating
60-120 seconds 30-60 seconds
Temperature
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
[Allowable Reflow Soldering Temperature and Time]
280
270
260
250
240
230
220
0 30
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Soldering
Gradual
Cooling
Time
60 90 120
Soldering Time (s)
Continued on the following page.