Information Before Mounting - Murata GRM Manual

! Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
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2. Information before Mounting

1. Do not re-use capacitors that were removed from the
equipment.
2. Confirm capacitance characteristics under actual applied
voltage.
3. Confirm the mechanical stress under actual process and
equipment use.
4. Confirm the rated capacitance, rated voltage and other
electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that
were in long-term storage.
6. Prior to measuring capacitance, carry out a heat
treatment for capacitors that were in long-term storage.
7. The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
8. We have also produced a DVD which shows a summary of
our recommendations, regarding the precautions for
mounting. Please contact our sales representative to
request the DVD.
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not
applied to the capacitors. Check the mounting in the
actual device under actual use conditions ahead of time.
1-1. In mounting the capacitors on the printed circuit
board, any bending force against them shall be kept
to a minimum to prevent them from any damage or
cracking. Please take into account the following
precautions and recommendations for use in your
process.
(1) Adjust the lowest position of the pickup nozzle so
as not to bend the printed circuit board.
2. Dirt particles and dust accumulated in the suction nozzle
and suction mechanism prevent the nozzle from moving
smoothly. This creates excessive force on the capacitor
during mounting, causing cracked chips. Also, the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked, and replaced periodically.
<Applicable to ZRB Series>
3. To adjust the inspection tolerance for automated
appearance sorting machine of mounting position,
because ZRB series are easier to shift the mounting
position than standard MLCC.
4. To check the overturn and reverse of chip.
5. To control mounting speed carefully, because ZRB series
is heavier than standard MLCC.
[Incorrect]
Suction Nozzle
Board
[Correct]
Support Pin
Deflection
Board Guide
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