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SERVICE MANUAL
Ver 1.0 1998. 06
MDR-RF950 is headphones
in MDR-RF950RK.
SPECIFICATIONS
MICROFILM
MDR-RF950

TABLE OF CONTENTS

1.
................................................................. 2
2.
......................................................... 3
3.
3-1. Checking/Adjusting Receiving Frequency ..................... 5
3-2. Checking/Adjusting Degree of Modulation
of Main Carrier (L + R) .................................................. 6
3-3. Checking/Adjusting Separation ...................................... 7
4.
4-1. Printed Wiring Boards ..................................................... 11
4-2. Schematic Diagram ......................................................... 13
5.
6.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
WIRELESS STEREO HEADPHONES
US Model
Canadian Model
................................................ 15
............................... 17

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Summary of Contents for Sony MDR-RF950

  • Page 1: Table Of Contents

    MDR-RF950 SERVICE MANUAL US Model Canadian Model Ver 1.0 1998. 06 MDR-RF950 is headphones TABLE OF CONTENTS in MDR-RF950RK. GENERAL ..............2 SPECIFICATIONS DISASSEMBLY ............3 ELECTRICAL ADJUSTMENTS 3-1. Checking/Adjusting Receiving Frequency ..... 5 3-2. Checking/Adjusting Degree of Modulation of Main Carrier (L + R) ..........6 3-3.
  • Page 2: General

    SECTION 1 This section is extracted from instruction manual. GENERAL – 2 –...
  • Page 3: Disassembly

    SECTION 2 DISASSEMBLY • This set can be disassembled in the order shown below. FRONT PLATE ASSY RX-BASE BOARD SW BOARD HANGER COVER (L) Note: Follow the disassembly procedure in the numerical order given. FRONT PLATE ASSY 4 Remove two solders of driver lead.
  • Page 4 SW BOARD 1 two head bands 2 screw (P2 × 6) 4 head cushion assy 3 switch support 5 SW board HANGER COVER (L) 2 hanger cover (L) 3 Remove two solders of battery lead. 1 two screws (P2 × 10) 1 two screws (P2 ×...
  • Page 5: Electrical Adjustments

    3. Enter 1 kHz 316 mVrms signal only to the Lch on the transmitter. 4. Place the transmitter away from the headphone (MDR-RF950) more than 5 m. 5. Set the volume control (RV301) on the RX-BASE board to the minimum position.
  • Page 6 3-2. Degree of Modulation of Main Carrier (L + R) Check and Adjustment Preparation: AF OSC TMR-RF950R MDR-RF950 Trans- Head- – – – mitter phones 600 Ω AUDIO IN (Lch) 1 kHz 316 mVrms [RX-BASE board] – Conductor Side –...
  • Page 7 3-3. Separation Check and Adjustment Preparation: AF OSC TMR-RF950R MDR-RF950 Trans- Head- – – – mitter phones 600 Ω AUDIO IN (Lch or Rch) 1 kHz 316 mVrms AC voltmeter oscilloscope – [RX-BASE board] – Conductor Side – Procedure: 1. Set the channel of the transmitter to CH2.
  • Page 8: Of Main Carrier (L + R)

    Adjustment Location: Transmitter (TMR-RF950R) [TX-BASE board] – Component Side – RV404 Degree of Modulation of Main Carrier (L + R) Adjustment J403 J402 (Lch) (Rch) – 8 –...
  • Page 9: Diagrams

    SECTION 4 DIAGRAMS Headphone (MDR-RF950) • IC Block Diagrams IC301 CXA1611N-T4 [RX-BASE board] – Component Side – [RX-BASE board] – Conductor Side – RV302 TUNING IC301 RV301 IC302 LA4533M POWER MUTE 10 MUTE SWITCH R-OUT R-IN BIAS L301 RV303 L-IN...
  • Page 12: Exploded Views

    SECTION 5 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they (2) HEADPHONE (L) SECTION may have some difference from the original are seldom required for routine service. Some one.
  • Page 13: Electrical Parts List

    SECTION 6 RX-BASE ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • Items marked “*” are not stocked since they When indicating parts by reference number, please include the board. parts list may be different from the parts speci- are seldom required for routine service.
  • Page 14 RX-BASE Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C311 1-163-243-11 CERAMIC CHIP 47PF JR311 1-216-295-00 SHORT C312 1-163-021-00 CERAMIC CHIP 0.01uF C313 1-163-113-00 CERAMIC CHIP 68PF JR312 1-216-295-00 SHORT JR313 1-216-295-00 SHORT C314 1-163-125-00 CERAMIC CHIP 220PF JR314 1-216-295-00 SHORT...
  • Page 15 RX-BASE Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R348 1-216-069-00 METAL CHIP 6.8K 1/10W R349 1-216-001-00 METAL CHIP 1/10W R350 1-216-053-00 METAL CHIP 1.5K 1/10W < VARIABLE RESISTOR > RV301 1-223-968-11 RES, VAR, CARBON 20K/20K (VOL) RV302 1-225-641-11 RES, VAR, CARBON 10K (TUNING) RV303...
  • Page 16 MDR-RF950 Sony Corporation 98F057022-1 Printed in Singapore © 1998. 6 9-924-925-11 Personal A&V Products Company Published by Quarity Engineering Dept. – 20 – (Shibaura)