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Electrical Characteristics
(Notes 2, 11) (Continued)
Note 9: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
) is dependent on the maximum operating junction temperature (T
= 125˚C), the maximum power
A-MAX
J-MAX-OP
dissipation of the device in the application (P
), and the junction-to ambient thermal resistance of the part/package in the application (θ
), as given by the
D-MAX
JA
following equation: T
= T
− (θ
x P
).
A-MAX
J-MAX-OP
JA
D-MAX
Note 10: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 11: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 12: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics.
Note 13: V
pin (Bandgap reference output) is for internal use only. A capacitor should always be placed between V
and GND1.
REF
REF
Block Diagram
20117305
LP3931 Block Diagram
5
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