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Package Dimensions - ON Semiconductor NCP1060 Manual

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D
8
5
1
4
NOTE 8
b2
TOP VIEW
e/2
A1
D1
e
SIDE VIEW
NCP1060, NCV1060, NCP1063, NCV1063

PACKAGE DIMENSIONS

PDIP−7 (PDIP−8 LESS PIN 6)
CASE 626A
A
H
E1
B
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
NOTE 3
L
SEATING
PLANE
C
M
eB
b
END VIEW
8X
0.010
C A
B
NOTE 6
M
M
M
www.onsemi.com
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
E
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
c
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
DIM
MIN
A
−−−−
A1
0.015
A2
0.115
b
0.014
b2
0.060 TYP
C
0.008
D
0.355
D1
0.005
E
0.300
E1
0.240
e
0.100 BSC
eB
−−−−
L
0.115
M
−−−−
29
MILLIMETERS
MAX
MIN
MAX
0.210
−−−
5.33
−−−−
0.38
−−−
0.195
2.92
4.95
0.022
0.35
0.56
1.52 TYP
0.014
0.20
0.36
0.400
9.02
10.16
−−−−
0.13
−−−
0.325
7.62
8.26
0.280
6.10
7.11
2.54 BSC
0.430
−−−
10.92
0.150
2.92
3.81
°
°
10
−−−
10

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