Philips VR109/55 Service Manual page 7

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With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
(2) Lift each lead of the flat pack-IC upward one by one,
using a sharp pin or wire to which solder will not
adhere (iron wire). When heating the pins, use a fine
tip soldering iron or a hot air desoldering machine.
(Fig. S-1-4)
Fine Tip
Soldering Iron
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using tweez-
ers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting point,
as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering iron
or hot air blower, pull up the wire as the solder melts
so as to lift the IC leads from the CBA contact pads
as shown in Fig. S-1-5.
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
06/28/2012
Desoldering Braid
Soldering Iron
Fig. S-1-3
Sharp
Pin
Fig. S-1-4
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using tweez-
ers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken to
ensure that the flat pack-IC is not being held by glue.
When the flat pack-IC is removed from the CBA,
handle it gently because it may be damaged if force
is applied.
To Solid
Mounting Point
CBA
Tweezers
1-3-2
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Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldeing Iron
Flat Pack-IC
Fig. S-1-6
U21_NOTE