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ASML PAS 5500 User Manual

Stepper
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R·I·T
Semiconductor & Microsystems
Fabrication Laboratory
Approved by:
Process Engineer
1

SCOPE

The purpose of this document is to detail the use of the ASML PAS 5500 Stepper. All users are expected
to have read and understood this document. It is not a substitute for in-person training on the system and
is not sufficient to qualify a user on the system. Failure to follow guidelines in this document may result
in loss of privileges.
2
REFERENCE DOCUMENTS
Batch Control PAS 5500 Training Module
Reticle Design Manual
PAS 5500 User Guide
PAS 5500 Job Definition
PAS Global Alignment Strategies
PAS 5500 Steppers up to and including /300 Stepper Introduction
3
DEFINITIONS
n/a
4

TOOLS AND MATERIALS

4.1
General Description - The ASML PAS 5500/200 is a 5x reduction, i-line stepper set up for
exposure of 6 inch wafers using 6 inch reticles. The system has 350nm resolution with a
0.48-0.60 variable numerical aperture. The maximum field size on the wafer is 22x22mm.
Overlay capability is better than 50nm. All lithography levels for a particular design are
included in a single stepper job.
RIT SMFL
/ /
Equipment Engineer
Title: ASML Stepper
Revision: B
/ /
Rev Date: 12/21/2010
Page 1 of 11

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Summary of Contents for ASML PAS 5500

  • Page 1 SCOPE The purpose of this document is to detail the use of the ASML PAS 5500 Stepper. All users are expected to have read and understood this document. It is not a substitute for in-person training on the system and is not sufficient to qualify a user on the system.
  • Page 2 Wafer Zero Level – The ASML Stepper utilizes zero level marks that are patterned and etched into the wafer before any other steps. An etch depth of 1200A +/- 10% allows the stepper to recognize the marks.
  • Page 3 SAFETY PRECAUTIONS Hazards to the Operator 5.1.1 The ASML uses ultraviolet light as well as lasers, and should only be operated with all of the covers closed. Safety glasses should be worn at all times. 5.1.2 The ASML stepper had mechanical hazards. Do not operate with open covers and do not open any covers during operation.
  • Page 4 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 Reticle Changer Unload Load INSTRUCTIONS Starting the System 6.1.1 Swipe the tool in on the Card Swipe System. 6.1.2 Verify that the computer is on. 6.1.3 Make sure that the computer is on the Main Menu, if not select 0 Exit. Do not exit from the Main Menu.
  • Page 5 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 Loading the Reticles 6.2.1 To remove the reticle box from the machine, under select Mat Hdl from the top of the screen and then 3 – Exchange Reticle Box. Click the Unlock button in the middle of the screen to unlock the reticle box.
  • Page 6 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 6.2.6 If your reticles do not have bar codes, use the Specify button to enter reticle IDs and then the Apply button to confirm. This will have to be done each time the reticles are loaded into the machine.
  • Page 7 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 6.4.8 Under Process Data you may adjust exposure energy, focus and tilt settings. The minimum energy is 40mJ/cm Under Illumination Mode select either conventional or annular. Numerical aperture and sigma may be specified. After changing any of these values you must select the Apply button for the changes to take effect.
  • Page 8 Introducing a Layer Shift 6.9.1 Select Process Data in your stepper job to enter a layer shift in microns. See Section 6.8 of the ASML PASS 5500 Job Creation Manual. APPROPRIATE USES OF THE TOOL No backside coated wafers, only wafers with clean backs may be processed in this tool.
  • Page 9 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 8.1.9 Input the Nominal Energy, the Energy Increment and the Window Size. Be sure to hit return after each entry. 8.1.10 Select Accept. 8.1.11 One wafer will be exposed with the nominal exposure in the center of the wafer. The remaining exposures will be divided up above and below this.
  • Page 10 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 8.3.4 Select 2-Sensor Module Commands. 8.3.5 Select 4-Monitor All Sensor Values. 8.3.6 Ensure that the Lens Temperature is 22.01C (+/- 0.02C). 8.3.7 Select Cancel at the top of the screen.
  • Page 11 R·I·T Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 REVISION RECORD Summary of Changes Originator Rev/Date Original Issue Sean O’Brien A-07/20/2010 Clarified some of the instructions Sean O’Brien B-12/21/2010 RIT SMFL Page 11 of 11...

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