Samsung UE32F6270SS Service Manual page 96

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Exploded Views and Parts List
Level
Loc.
Part Code
..3
BN96-26726C
...4
BN02-00152A
...4
BN02-00152F
...4
BN60-00554A
...4
BN63-10489A
1
M0017 BN91-10610G
.2
M0014 BN94-06715E
..3
BN61-08781A
...4
0103-004628
..3
BN62-00273B
..3
BN62-00367A
..3
BN67-00364C
..3
BN97-07143A
...4
BN46-00109H
...4
BN46-00110N
...4
BN46-00115J
..3
BN97-07649J
...4
0202-001899
...4
DS01A 0401-001056
...4
0403-001783
...4
0404-001404
...4
0404-001787
...4
0406-001200
...4
0406-001271
...4
0406-001290
...4
0501-000279
...4
0501-000445
...4
0505-000110
...4
0505-002560
...4
0505-002598
...4
0801-002701
...4
0801-002780
...4
0801-003330
...4
0904-002803
...4
1001-001545
...4
1103-001487
...4
1105-002338
...4
1105-002430
...4
1201-003183
...4
1201-003526
8
Description & Specification
ASSY MISC P-SHIELD SOURCE,PCB;Y13 SF-LED
TAPE ETC-SHEET FIXING;Y13 Slim F-LED,PET
TAPE ETC-SHEET FIXING;Y13 Slim F-LED,PET
SPACER-SOURCE;SNB 40/46/55,Silicone-Rubb
SHIELD-SOURCE PCB;Y13 SF-LED 32",EGI-SEC
ASSY CHASSIS;UE32F6270SSX*
ASSY PCB MAIN;UE32F6270SSXZG
HOLDER-SIDE AV;UF6100,HIPS,BK0020,HB,W/W
RESIN-HIPS;HF-1690H,K2901,BK0020,1.5mm H
HEAT SINK-PS;TV Echo-P,A5052,5t,BLACK,40
PAD GAP;F6400,SILICON,35 35 mm,6.5,Light
RUBBER-FOOT;X13,RUBBER,10*10,6,Gray,SQUA
ASSY DRM-KEY;CI(BN46-00115J),HDCP(BN46-0
KEY CODE-CERTIFI;MAC,TV/AV,General
KEY CODE-CERTIFI;MIRACAST,TV,X12 /X13
KEY CODE-CERTIFI;CI+,TV,2013X,Euro
ASSY SMD;F6270,DVB-T/C/S2,BN41-01958B
SOLDER-CREAM;M705-GRN360-K2-VT,25-36um,S
DIODE-SWITCHING;MMBD4148SE,100V,200mA,SO
DIODE-ZENER;BZB84-C6V2,5.8/6.6V,300mW,SO
DIODE-SCHOTTKY;BAT721C,40V,200mA,SOT-23,
DIODE-SCHOTTKY;SS3P4,40V,3000mA,DO-220AA
DIODE-TVS;RCLAMP0504F,6/-/-V,150W,SC-70
DIODE-TVS;RCLAMP0524P,6/-/-V,150W,SLP251
DIODE-TVS;3.0SMCJ20A,22.2/-/24.5V,3000W,
TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT-
TR-SMALL SIGNAL;KTC3875S-Y,NPN,150mW,SOT
FET-SILICON;2N7002,N,60V,115mA,7.5ohm,0.
FET-SILICON;AO6415,P,-20V,-3.3A,0.15ohm,
FET-SILICON;AP2317GN,P,-20V,-4.2A,0.052o
IC-CMOS LOGIC;74VHCT125A,BUFFER,TSSOP,14
IC-CMOS LOGIC;74LVC1G17,SCHMITT-TRIGGER
IC-CMOS LOGIC;Octal buffer,DQFN,20P,4.5x
IC-USC;AU6258S-JKF,QFN,28Z30,5.0mm X 5.0
IC-ANALOG MULTIPLEX;TS3USB221ERSER,R-PQF
IC-EEPROM;AT24C256C-SSHL-T,256Kbit,32Kx8
IC-DDR3 SDRAM;K4B4G1646B-HCMA,DDR3 1866,
IC-DDR3 SDRAM;K4B2G1646E-BCMA,DDR3 1866,
IC-AUDIO AMP;DRV612,HTSSOP,14P,5x4.4mm,D
IC-AUDIO AMP;TAS5745,QFP,48Z30,7x7mm,DUA
Copyright© 1995-2013 SAMSUNG. All rights reserved.
Qty.
SA/SNA
2
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2
SNA
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SNA
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2
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SC
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