LG CG225 Service Manual
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Service Manual
CG225_LG225
Date: March, 2006 / Issue 1.0

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Summary of Contents for LG CG225

  • Page 1 Service Manual CG225_LG225 Date: March, 2006 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the CG225.
  • Page 3 - 2 -...
  • Page 4: Table Of Contents

    Table of Contents 1. Introduction ........5 5. DOWNLOAD ........90 5.1 Download Setup........90 1.1 Purpose........... 5 5.2 Download Procedure ......91 1.2 Regulatory Information......5 1.3 Abbreviations .......... 7 6. SERVICE AND CALIBRATION ..98 2. General Performance...... 9 6.1 Service S/W ...........98 2.1 Product Name .........
  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the CG225 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. Introduction E. Notice of Radiated Emissions The CG225 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
  • Page 8: Abbreviations

    1. Introduction 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Base Band Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. Introduction Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Front End Module Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating Travel Adapter...
  • Page 10: General Performance

    2. General Performance 2. General Performance 2.1 Product Name CG225 : Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment GSM850/ E-GSM/DCS/PCS Quad Band Supporting Standard Phase 2+ SIM Toolkit : Class 1,2,3 GSM-850 TX : 824 - 849 MHz...
  • Page 11: H/W Features

    2. General Performance 2.4 H/W Features Item Feature Comment Form Factor Dual LCD Folder Capacity Cell Size: Standard Standard: Li-Ion, 1000mAh(Min) 5.7(L)x34.15(W)x53.55(H)mm Battery Packing Type: Inner Pack Size Standard: 85.3 x 48 x 22.9 mm L x W x H Weight 92.5g With Battery...
  • Page 12 2. General Performance Item Feature Comment Antenna External Type Quad-band System connector 24 Pin Ear Phone Jack 3 Pole (φ2.5mm) PC synchronization CDROM Memory Flash : 128Mbit / SRAM : 64Mbit Speech coding FR, EFR, HR, AMR Data & Fax Built in Data &...
  • Page 13: S/W Features

    2. General Performance 2.5 S/W Features Item Feature Comment RSSI 0~5 level Battery Charging 0~4 level Key Volume 0~5 level Keypad Volume 0~5 level Effect sound volume 0~5 level Ring Volume 0~5 level Time/Date Display Text Input Multi-language Quick Access Mode Schedule/Ring Tone/Phonebook GPRS PC Sync Schedule/Phonebook/SMS...
  • Page 14 2. General Performance Item Feature Comment Mute Call Divert Call Barring Call Charge Call Duration SMS (EMS) EMS Send/Receive/Save Melody/Picture/Animation WAP Browser WAP 2.0 Java CLDC v1.0.3 / MIDP v1.0.3 Wall Paper Max. 10 preset Download Melody/ Over the WAP Wallpaper (MMS) Long Message Max.
  • Page 15: H/W Circuit Description

    3. H/W Circuit Description 3. H/W Circuit Description 3.1 RF Transceiver General Description The RF parts consist of a transceiver part, a power amplifier part, a front-end module part, a voltage supply part, and a VC-TCXO part. The AeroII transceiver is composed of single RF chipset, Si4210-GM[U502] which is a quad-band GSM/GPRS wireless communications.
  • Page 16 3. H/W Circuit Description FL501 U502/Si4210 Front End Module Baseband Baseband EGSM (TI) (TI) EGSM U102 U102 (Calypso +) (Calypso +) U101 U101 X501 (IOTA) (IOTA) VC-TCXO VCO + FREQUENCY VCO + FREQUENCY SYNTHESIZER SYNTHESIZER 26MHz Figure 1. RF Receiver Block 3.2.1.
  • Page 17 3. H/W Circuit Description 3.2.2. Synthesizer The Aero II transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode.
  • Page 18: Transmitter Part

    3. H/W Circuit Description 3.3 Transmitter Part The Transmitter part contains the transmitter parts of Si4210-GM[U502], Power Amp Module[U501] and Front End Module[FL501]. The transmit section of Si4210-GM[U502] consists of an I/Q base band up_converter, an offset phase-locked loop(OPLL) and two output buffers that can drive external power amplifiers(PA).
  • Page 19: Power Amplifier

    3. H/W Circuit Description 3.3.1. Power Amplifier The RF3166 [U501] is a quad-band EGSM 900/GSM 850/DCS/PCS power amplifier module that incorporat es an indirect closed loop method of power control. The indirect closed loop is fully self- contained and it do es not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
  • Page 20: Power Supplies And Control Signals

    3. H/W Circuit Description 3.3.3. Power Supplies and Control Signals An external regulator(U503) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. VBAT RF2.85V U503 VOUT RF_EN R1114N281D-TR-F C560 C532 C533 C534...
  • Page 21: Digital Baseband (Dbb) Processor

    3. H/W Circuit Description 3.4 Digital Baseband (DBB) Processor Figure 7. Top level block diagram of the Calypso- 3.4.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- - Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
  • Page 22: Block Description

    3. H/W Circuit Description 3.4.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus sta ndard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
  • Page 23 3. H/W Circuit Description 3.4.3. RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPDI/IO(4) GPIO4 TSPEN0...
  • Page 24: Sim Interface

    DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 0.1u Figure 8. SIM Interface 3.4.5. UART Interface CG225 has two UART Drivers as follow : UART : Hardware Flow Control / Fax & Data Modem - 23 -...
  • Page 25 3. H/W Circuit Description UART MODEM (UART1) Resource Name Description TX_MODEM Transmit Data RX_MODEM Receive Data CTS_MODEM Clear To Send RTS_MODEM Request To Send GPIO 3 Data Set Ready - 24 -...
  • Page 26: Analog Baseband (Abb) Processor

    3. H/W Circuit Description 3.4.6. GPIO Map In total 16 allowable resources, CG225 is using 13 resources except 3 resources dedicated to SIM and Memory. CG225 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
  • Page 27 3. H/W Circuit Description • Six Low-dropout (LDO), linear voltage regulators targeted core, general I/O, memory I/O, SIM I/O • High voltage (20V) Li-Ion or Ni-MH battery charging control • Voltage detectors (with power-off delay) • Voice Codec VCMEM VRMEM VCDBB VSDBB VRIO...
  • Page 28 3. H/W Circuit Description 3.5.2. Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
  • Page 29 3. H/W Circuit Description 3.5.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has again of typically 25.6 dB ( 1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
  • Page 30 3. H/W Circuit Description 3.5.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
  • Page 31 3.5.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in CG225. - 30 -...
  • Page 32 3. H/W Circuit Description RSIM VRSIM 1.8/2.9 V Card 10 mA VBAT µ RRAM VRRAM VCRAM SRAM 1.8/2.8 V Core 50 mA µ 4.7 F Memories RMEM VCMEM VRMEM 1.8/2.8 V Core 60 mA µ 4.7 F Sel 2.8 V VLMEM Memories VSDBB...
  • Page 33 3. H/W Circuit Description Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
  • Page 34 3. H/W Circuit Description 3.5.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of CG225 is as follow. 3.86V~3.75V 3.74V~3.68V 4.2V~3.87V 3.67V~3.60V Figure 15. Battery Block Indication 1.
  • Page 35 → IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. → CHARGER_IC :When a charger voltage is above VBAT+0.4V on VCHG. 3.5.10. Memories CG225 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.5.11. Display & FPCB Interface LCD module include: →...
  • Page 36 3. H/W Circuit Description Connector Interface Spec. Pin # Description Ground L_D(0) LCD Data L_D(1) LCD Data L_D(2) LCD Data L_D(3) LCD Data L_D(4) LCD Data L_D(5) LCD Data L_D(6) LCD Data L_D(7) LCD Data LCD_RESET Reset LCD_ID LCD ID detect L_MAIN_CS MAIN LCD Chip select L_SUB_CS...
  • Page 37 3. H/W Circuit Description 3.5.12. Keypad Switching & Scanning Table 3-10. Keypad Map KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 LEFT RIGHT DOWN KBR1 CLEAR KBR2 VOL_UP KBR3 VOL_DOWN KBR4 STAR SHAP SEND DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure16 ). SW301 CAM SIDE KEY VA301...
  • Page 38: Key Backlight

    3. H/W Circuit Description 3.5.13. Keypad back-light Illumination There are 6 Deep Blue LEDs in Main Board for Keypad Backlight and 6 Deep Blue LEDs in Upper Board for Upper Board Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . KEY BACKLIGHT VBAT LEDB...
  • Page 39 C243 Figure 19. Microphone system When a call is established, MICBIAS signal goes up to ‘2.5V’ in the CG225. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA201, VA202 are employed to enhance ESD immunity. Main Mic Circuit is same Upper MIC...
  • Page 40 3. H/W Circuit Description Head set Jack Interface Close to Ear-jack EAR-MIC V_IO R218 R221 5.6K R222 HSMICBIAS C247 R224 4.7u C248 C249 (1608) 4.7u (1608) HOOK_DETECT Close to ABB R225 C250 C251 C252 C253 HSMICP L201 100nH R227 C254 0.1u C255 L203...
  • Page 41 3. H/W Circuit Description MIDI SOUND circuit description MIDI V_IO 1V8_MIDI V_IO VBAT 1V8_MIDI C202 C203 C204 4.7u U206 TC7SH08FS C205 0.1u C206 0.1u C207 0.1u C208 0.1u C209 1000p MCLK C210 0.1u _RST CLKI R204 PLLC TXOUT _MIDI_CS _CS__SS R205 6.8K A(1) A(2)
  • Page 42 3. H/W Circuit Description Receiver and Speaker circuit R206 RCV_P C221 R207 RCV_N U205 COM2 SPK_RCV_N COM1 SPK_RCV_P SPK_EN R212 100K NLAS4684FCT1G VBAT C230 0.1u Figure 22. Receiver and Speaker Circuit of FPCB A single analog switch is employed to support both voice and speaker shone mode with RCV_P. In the speaker phone mode the SPK_EN port sets ‘H’...
  • Page 43: Camera Circuit

    3. H/W Circuit Description 3.5.16. Camera Circuit Under camera action mode, MV3018SNK wholly controls LCD by itself to execute camera functions, while, under bypass mode, MV3018SNK lets all LCD driver-related signals bypass it, as if it does not exist at all in the system. Figure 23.
  • Page 44 3. H/W Circuit Description 2V85_CAM 2V85_CAM CAMERA R201 R202 C201 4.7K 4.7K 1000p U207 TC7SH08FS C_SCK C_SDA MCLK 2V85_CAM R203 L_A(1) LREN L_WR LWEN RVDD1 L_MAIN_CS LCS1 RVDD2 L_SUB_CS LCS2 C211 C212 0.1u L_D(0) L_D(1) MVDD L_D(2) SVDD L_D(3) LVDD L_D(4) U202 L_D(5)
  • Page 45 3. H/W Circuit Description LCD CONN CN401 100ohm/15pF/18V FL401 ICVE31186E150R101FR FL402 ICVE31186E150R101FR L_D(0) INOUT_A1 INOUT_B1 INOUT_A1 INOUT_B1 L_D(8) L_D(1) INOUT_A2 INOUT_B2 INOUT_A2 INOUT_B2 L_D(9) L_D(2) L_D(10) INOUT_A3 INOUT_B3 INOUT_A3 INOUT_B3 L_D(3) INOUT_A4 INOUT_B4 INOUT_A4 INOUT_B4 L_D(11) L_D(4) L_D(12) INOUT_A5 INOUT_B5 INOUT_A5 INOUT_B5 L_D(5)
  • Page 46 3. H/W Circuit Description FPCB CAMERA CONN C_PWR_AVDD C_PWR_DVDD C_PWDN C_MCLK C_RST C_PCLK C_SCK C_CD0 C_SDA C_CD1 C_CD2 C_HS C_CD3 C_VS C_CD4 C_CD7 C_CD5 C_CD6 ENBY0019501 AXK720145G Figure 27. FPCB Camera Connection - 45 -...
  • Page 47: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Main Components Placement - 46 -...
  • Page 48: Fpcb Components Placement

    4. TROUBLE SHOOTING 4.2 FPCB Components Placement RECEIVER & SPEAKER VIBRATOR LCD_40PIN FPCB LCD Module Backup Battery 60PIN FPCB 4.3 Baseband Components RECEIVER & SPEAKER VIBRATOR LCD Module - 47 -...
  • Page 49: Main Components (Description)

    4. TROUBLE SHOOTING 4.4 Main Components (Description) MAIN Microphone U304 Folder Switch MIC201 CN401 LCD connector CN201 Ear-Mic jack U401 LCD Back Light LED charge pump CN401 IO connector SW501 RF Mobile switch U502 RF Trnaceiver F400 Quad FEM U501 Power Amplifier Module U404 CMOS INVERTER...
  • Page 50: Power On Trouble

    4. TROUBLE SHOOTING 4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...
  • Page 51: Charging Trouble

    4. TROUBLE SHOOTING 4.6 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 5.2V • Charging temperature ADC range • Charging time : 3h min under - ~ -20°C : small charging operation. •...
  • Page 52 4. TROUBLE SHOOTING Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure •...
  • Page 53: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.7 LCD Display Trouble LCD CONNECTOR Check soldering around connector FPCB 40Pin & LCD Connect Check BackEND IC LCD Control Signals From Main Board • MLED , L_MAIN_CS, L_SUB_CS ,LCD_RESET, L_WR, LCD_ID • L_A(1), L_D(0)~L_D(15), IFMODE Check Points •...
  • Page 54 4. TROUBLE SHOOTING START Refer to Pow er is su pplied to Power On Tr ouble the bo ard? Connection between Reco nnect LCD Module and board is O K? Module Re_so ld er t he MAIN CN401, FPCB CN1,CN3 MAIN CN401, FPCB is so ldered well? CN1,CN3...
  • Page 55: Camera Trouble

    4. TROUBLE SHOOTING 4.8 Camera Trouble SETTING : Connect PIF, and remote switch ON at PIF CN401 U202 U203 - 54 -...
  • Page 56 4. TROUBLE SHOOTING START Does t he LCD Go to the LCD trouble Its elf ha s on trouble Set the camera button ON Check Check the voltage of Pin5 of U202 the voltage of Pin3 Re_so ld er U202 is 2.85V of U202 is 2.85V? Check the...
  • Page 57: Receiver Trouble

    4. TROUBLE SHOOTING 4.9 Receiver Trouble Block Diagram Control SPKP/ Calypso YMU792 SPKN (U101) (U201) SPK_EN Analog SW RCV_SPKP/ (U204) RCV_SPKN RCV_P/ RECEIVER IOTA Analog SW & RC filter (U100) (U205) SPEAKER RCV_N Melody Generation • U201(YMU792,MIDI) is controlled by DBB. •...
  • Page 58 4. TROUBLE SHOOTING Speaker Part U201 U205 Receiver Part FPCB 60 Pin connector Main 60 Pin connector Speaker Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. •...
  • Page 59 4. TROUBLE SHOOTING 4.9.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the boa rd. at R206,R207? Re_so ld er t he R212.
  • Page 60 4. TROUBLE SHOOTING 4.9.2. Speaker(MIDI) Trouble SPK_EN Operating Receiv er On ly MIDI or SPK mode START Enter into Engineering Mode and go to menu "Baseband Alert Ring" Paths o f U201 Change the boa rd sig nals are O K? Does sin e wave appear Change the U201 at R208...
  • Page 61: Microphone Trouble

    4. TROUBLE SHOOTING 4.10 Microphone Trouble Circuit Diagram Close to MIC R214 R215 MICBIAS 2.4K Close to ABB C234 C235 4.7u C236 R216 MIC201 MICP OSF213-42DC C237 0.1u C238 C239 C240 R220 MICN C241 0.1u R223 C243 - 60 -...
  • Page 62 4. TROUBLE SHOOTING Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components Trouble Shooting Setup Trouble Shooting Procedure •...
  • Page 63 4. TROUBLE SHOOTING START Connect the handset to network equipment and setup call. Re_sold er the The vo ltage of R21 4 The so ldering of R21 4 R214 is 2.5V? is O K? ABB is out of order. Change th e board. Soldering betw een Re_sold er the M IC MIC and Boa rd...
  • Page 64: Vibrator Trouble

    4. TROUBLE SHOOTING 4.11 Vibrator Trouble Block Diagram VBAT R315 VIBRATOR VBAT R314 R318 Q302 VIBRATOR R320 1.5K R322 EMZ2 100K C309 4.7u (1608) Vibrator Operation Check Points • Vibrator is controlled by DBB GPIO • VCC lines (VBAT) of U303 •...
  • Page 65 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Vibrator Voltage of R320 Signal of pin3 of U30 3 Change th e board is O K? is 2. 8V Change the U303 Re_sold er Pin1 of U 303 is 0V ? Check th e solder ing of R314 R314...
  • Page 66: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.12 Keypad Backlight Trouble Block Diagram KEY BACKLIGHT VBAT LEDB R340 R341 VA304 Backlight Operation • The keypad LED backlight is controlled with LEDB signal. • Keypad_Main signal from DBB. • The LEDs are forward biased and turned on. Trouble Shooting Setup •...
  • Page 67 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Keypad On The Volt age ABB is out of order. Check th e solder ing Of LEDB signal Change th e Board. of R 340and R 341 is ab out 0V? Power off and Measure the Resistor Value of all LEDs.
  • Page 68: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.13 Folder ON/OFF Trouble Block Diagram FOLDER SWITCH V_IO R324 FOLDER U304 OUTPUT C315 C316 0.1u 0.1u GND2 PGND GND1 A3212EEH-T Slide Operation • There is a magnet to detect the Slide status, up or down. • If a magnet is close to the Folder Switch(U304), the voltage at pin 2 of U304 goes to 0V. Otherwise, 2V8_IO.
  • Page 69 4. TROUBLE SHOOTING Caution! If use PIF jig, the START remote sw itch is turned o ff. Folder ON status. Not magnetized Re_sold er the The all path s co nnect ed U202 to U 202 are OK? Re_sold er the R324. Pin1 of U 202 is 2.8V? Recombi ne of Main LC D Operating?
  • Page 70: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.14 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 0.1u Connection between SIM and DBB Check Points • SIM_CLK, SIM_IO, SIM_RST • Contact between SIM and socket -.
  • Page 71 4. TROUBLE SHOOTING START Insert the SIM Card Re_sold er the The so lder ing of SIM con nector CN403 is O K? The all path s co nnected Re_sold er the to C N403 are OK? C422,C423,C424,C421,R411 When SIM in ser t that , Change the ABB V_SIM Voltage is 2.85V? SIM car d is br oken .
  • Page 72: Earphone Trouble

    4. TROUBLE SHOOTING 4.15 Earphone Trouble Block Diagram EAR_JACK SPEC Receiver Close to Ear-jack EAR-MIC V_IO R218 R221 5.6K R222 HSMICBIAS C247 R224 4.7u C248 C249 (1608) 4.7u (1608) HOOK_DETECT Close to ABB R225 C250 C251 C252 C253 HSMICP L201 100nH R227 C254...
  • Page 73 4. TROUBLE SHOOTING cf) PRBS : Pse udo Ran dom Bit Sequence START Insert the earphone into the headset. Does the Audio profile chan ge 1. Earpho ne detecti on problem to the e arphon e mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you...
  • Page 74 4. TROUBLE SHOOTING 1. Earpho ne detecti on problem The Volt age Soldering Re_sold er the at HOOK_DETECT point Of C250, R225 is OK? C250, R225 is 0V? Pin3 an d Pin4 of CN201 Change the CN201 are ope n? The ABB is out of order.
  • Page 75 4. TROUBLE SHOOTING Headset Input Pin (This pin connects with Microphone of Ear-Mic) Headset Output Pin The components of HSO - 74 -...
  • Page 76: Rf Rx Pass Trouble Shooting

    4. TROUBLE SHOOTING 4.16 RF Rx pass Trouble Shooting START E5515C : Test M ode CH190, 7 level setti ng (TCH) CH190, -60 dBm setti ng (BCCH) Spectrum Anal yzer setti ng Osci lloscope setti ng Check Regulat or C ircuit Check VCTCXO Circuit Check...
  • Page 77 4. TROUBLE SHOOTING 4.16.1 Checking Regulator Circuit (Rx pass continued) Check P in 5 VBAT RF2.85V Regulat or circuit is OK U503 2.85V? See next page to check VOUT VCTCXO circuit RF_EN R1114N281D-TR-F C560 C532 C533 C534 C535 Pin 3 H igh? Repl ace U503 1000p 4.7u...
  • Page 78 4. TROUBLE SHOOTING 4.16.2 Checking VCTCXO Circuit (Rx pass continued) Check P in 3 of X 501 VCTCXO circuit is OK See next page to check 26MHz ? PLL circuits Repl ace X501 Pin 4 2.85V ? Check U5 03 RF2.85V X501 26MHz...
  • Page 79 4. TROUBLE SHOOTING 4.16.3 Checking PLL Circuit (Rx pass continued) Check S _CLK, S_EN, S_DATA Signal is Down load SW norm al? S_DATA PLL circuit is OK . See nest page to check FEM & Mobile SW S_EN S_CLK R530 S_CLK R531 S_EN...
  • Page 80 4. TROUBLE SHOOTING 4.16.4 Checking FEM & Mobile SW (1) (Rx pass continued) Check S W501 Pin 1,2 wi th no RF cabl e connected Short ? Repl ace SW501 Check S W501 Pin 1,2 wi th RF cabl e connected Open ? Repl ace SW501 Rx st andalone m ode is needed...
  • Page 81 4. TROUBLE SHOOTING 4.16.5 Checking FEM & Mobile SW (2) (Rx pass continued) SW501 PIN15 ANT_SW1 : ANT_SW1 PIN14 ANT_SW2 : ANT_SW2 SW501 KMS-507 C516 RF2.85V C529 1000p GSM850_RX1 GSM850_RX2 ANT_SW1 CTRL1 GSM900_RX1 ANT_SW2 CTRL2 GSM900_RX2 FL501 GSM1800_RX1 DGM081 GND1 GSM1800_RX2 GND2 GSM1900_RX1...
  • Page 82 4. TROUBLE SHOOTING 4.16.6 Checking Rx I/Q (Rx pass continued) Check I /Q Repl ace U502 I/Q is nor mal? Redownload t he sof tware & Cal ibrati on RXQP RXQP RXIP RXIP R531 S_EN R532 S_DATA C561 C531 C562 RXQN SCLK RXQP...
  • Page 83: Rf Tx Pass Trouble Shooting

    4. TROUBLE SHOOTING 4.17 RF Tx pass Trouble Shooting START E5515C : Test M ode CH190, 7 level setti ng (TCH) CH190, -60 dBm setti ng (BCCH) Spectrum Anal yzer setting Osci lloscope setti ng Check Regulat or C ircuit Check VCTCXO Circuit Check...
  • Page 84 4. TROUBLE SHOOTING 4.17.1 Checking Regulator Circuit (Tx pass continued) Check P in 5 VBAT RF2.85V Regulat or circuit is OK . See next page to check 2.85V ? U503 VCTCXO circuit VOUT RF_EN R1114N281D-TR-F Pin 3 H igh ? Repl ace U503 C560 C532...
  • Page 85 4. TROUBLE SHOOTING 4.17.2 Checking VCTCXO Circuit (Tx pass continued) Check P in 3 of X 501 VCTCXO circuit is OK 26MHz ? See next page to check FEM & Mobile SW Pin 4: 2. 85V ? Repl ace X501 Check U5 03 PIN3 PIN2...
  • Page 86 4. TROUBLE SHOOTING 4.17.3 Checking PLL Circuit (Tx pass continued) Check S _CLK, S_EN, S_DATA Signal is Down load SW norm al? PLL circuit is OK . S_DATA See nest page to check FEM & Mobile SW S_EN S_CLK - 85 -...
  • Page 87 4. TROUBLE SHOOTING 4.17.4 Checking Tx I/Q (Tx pass continued) Check I /Q Norm al? Repl ace U101 Redownload t he sof tware and calibrat ion TXIP TXQP - 86 -...
  • Page 88 4. TROUBLE SHOOTING 4.17.5 Checking PAM Control Signal (Tx pass continued) Check AP C, PA_ON, PA_BAND Norm al? Downl oad the S W Cont rol signal is OK . See next page t o Check FE M & Mobi le SW VBAT C504 C501...
  • Page 89 4. TROUBLE SHOOTING 4.17.6 Checking FEM & Mobile SW (1) (Tx pass continued) Tx st andalone m ode is needed Check RF Level FL501 Pin 10,12 (Tabl e 2-1) 20dBm Repl ace U501 Check ANT_S W1, ANT_SW2 of FL501 ANT_SW1=Low & ANT_SW2=High or Repl ace ANT_SW1=High &...
  • Page 90 4. TROUBLE SHOOTING 4.17.7 Checking FEM & Mobile SW (2) (Tx pass continued) SW501 PIN15 ANT_SW1 : ANT_SW1 PIN14 ANT_SW2 : ANT_SW2 SW501 KMS-507 C516 RF2.85V C529 1000p GSM850_RX1 GSM850_RX2 ANT_SW1 CTRL1 GSM900_RX1 ANT_SW2 CTRL2 GSM900_RX2 FL501 GSM1800_RX1 DGM081 GND1 GSM1800_RX2 GND2 GSM1900_RX1...
  • Page 91: Download

    5. DOWNLOAD 5. DOWNLOAD 5.1 Download Setup 5.1.1 In case of using the Data kit Figure 6-1 Describes Download Setup Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.
  • Page 92: Download Procedure

    5. DOWNLOAD 5.2 Download Procedure 5.2.1. Computer Program file -> MultiGSM.EXE Click - 91 -...
  • Page 93 5. DOWNLOAD 5.2.2. Click the “Setting” button. Then, choose Configuration which is going to download. - 92 -...
  • Page 94 5. DOWNLOAD 5.2.3. Configuration Setting C:\GSMULTI\Model\CG225.dll - 93 -...
  • Page 95 5. DOWNLOAD 5.2.4. Press “Start Button”. - 94 -...
  • Page 96 5. DOWNLOAD 5.2.5. After “Start Button”, Which Stand-by condition - 95 -...
  • Page 97 5. DOWNLOAD 5.2.6. SW downloading Condition. CG225 - 96 -...
  • Page 98 5. DOWNLOAD 5.2.7. SW downloading END Condition. - 97 -...
  • Page 99: Service And Calibration

    6. SERVICE AND CALIBRATION 6. SERVICE AND CALIBRATION 6.1 Service S/W 6.1.1 RF Calibration Program 1. Execute "Hot_KimchiD.exe" 2. Click on "APPLY" button. CG225 CG225 3. Click on "CALIBRATION START" - 98 -...
  • Page 100 6. SERVICE AND CALIBRATION 6.1.2. RF Calibration Program 4. Click on "CALIBRATION START" button. CG225 CG225 - 99 -...
  • Page 101 Note - 100 -...
  • Page 102: Circuit Diagram

    MODEL CG225 060210 G.C. LIM Designer KBR(0:4) UFLS RPWON J.W.LEE ON_SW ON_SW Checked VBAT VBAT VBAT DRAWING DBB/ABB NAME URXD Approved H.KANG UTXD DRAWING Iss. Notice No. Date Name REV_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 101 -...
  • Page 103 Designer C255 L203 R229 L202 R228 C256 (1608) 100nH 100nH C257 C258 CN201 J.W.LEE Checked DRAWING AUDIO/MIDI/CAMERA NAME R231 Approved H.KANG JACK_DETECT R232 DRAWING Iss. Notice No. Date Name LG Electronics Inc. REV_1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 102 -...
  • Page 104 1000p C321 1000p C322 J.W.LEE KBC(0) 1000p Checked C323 1000p DRAWING KBC(1) C324 MEMORY/MMI 1000p KBC(2) C325 NAME KBC(3) 1000p Approved H.KANG KBC(4) DRAWING REV_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 103 -...
  • Page 105 PCM_RX J.W.LEE AUXOP Checked AUXON DRAWING C425 0.1u CONN.(LCD/SIM/IO) AUXI NAME C426 Approved H.KANG R418 R419 C427 C428 100p 220K 220K C429 47p DRAWING Iss. Notice No. Date Name LG Electronics Inc. REV_1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 104 -...
  • Page 106 TEMPSENSE Section Date Sign & Name Sheet/ Sheets MODEL R516 CG225 4.7K 060210 C.S.CHO Designer B.Y.YANG Checked DRAWING RF_AERO II NAME Approved H.KANG DRAWING REV_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 105 -...
  • Page 107 ENBY0020201 AXK8L40125G SPKREC_N SPKREC_L_N SPKREC_P SPKREC_L_P VISION MARK Section Date Sign & Name Sheet/ CG225 Sheets MODEL Designer 060202 Checked DRAWING FPCB NAME Approved DRAWING Iss. Notice No. Date Name REV_1.0 LG Electronics Inc. LG Electronics Inc. - 106 -...
  • Page 108: Pcb Layout

    8. pcb layout - 107 -...
  • Page 109 8. pcb layout - 108 -...
  • Page 110 8. pcb layout - 109 -...
  • Page 111 8. pcb layout - 110 -...
  • Page 112: Engineering Mode

    [2-8-4] HANDSFREE [2-8-5] DEFAULT VALUE [2-3] Camera [2-8-6] DAI TEST [2-3-1] Preview [2-8-7] LOOPBACK TEST [2-3-2] Settings [3] CG225 VERS [2-4] FONT [4] ENG MODE [2-4-1] FONT 810 [4-1] CELL ENVIRON [2-4-2] FONT 810i [4-2] LOCATION INFO [2-4-3] FONT 816...
  • Page 113: Standalone Test

    10. STANDALONE TEST 10. STANDALONE TEST 10.1 Setting Method 10.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 10.1.2 Tx Test 1.
  • Page 114: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW - 113 -...
  • Page 115 - 114 -...
  • Page 116: Replacement Parts

    DECO,SPEAKER MDAN0010101 CG225 DECO SPEAKER Silver GRAY MFBC00 FILTER,SPEAKER MFBC0021501 SILVER MGAD00 GASKET,SHIELD FORM MGAD0109401 CG225 LOWER FPCB GROUND 3.5X3.5X3.0t Gold MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver MPBG00 PAD,LCD MPBG0044701 CG225 PAD LCD LOWER Black Without...
  • Page 117 GMZZ0015101 1.4 mm,3.0 mm,MSWR3(FN) ,N ,+ ,- , Silver MCCH00 CAP,SCREW MCCH0077901 CG220 Folder Screw Cap 'L' Black MCCH01 CAP,SCREW MCCH0078501 CG225 Folder Screw cap 'R' Black MGAD00 GASKET,SHIELD FORM MGAD0111901 CG225 PCB GASKET 2 Gold DEEP MHFD00 HINGE,FOLDER MHFD0009901 6.5Kgf.mm(PREXCO)
  • Page 118 INSULATOR MIDZ0080201 CG225Rear Sim INSULATOR Blue MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White MPBR00 PAD,BUTTON MPBR0003301 CG225 Rear Sidekey PAD Black AKAZ00 KEYPAD ASSY AKAZ0015101 CG225 Black GMZZ00 SCREW MACHINE GMZZ0015101 1.4 mm,3.0 mm,MSWR3(FN) ,N ,+ ,- , Silver...
  • Page 119: Main Component

    11. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0043501 PCB ASSY, SACB00 SACB0028401 FLEXIBLE,INSERT 3 V,1.2 mAh,COIN ,MATUESHITA Backup BATTERY...
  • Page 120 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SAFF00 PCB ASSY,MAIN,SMT SAFF0058502 PCB ASSY,MAIN,SMT SAFC00 SAFC0053901 BOTTOM C101 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C102 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C103 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C104 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP...
  • Page 121 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C134 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP C136 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C137 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C201 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 122 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C243 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C244 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C245 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C246 CAP,CERAMIC,CHIP ECCH0007901...
  • Page 123 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C316 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C317 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C318 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C319 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C320 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 124 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C501 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C502 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C503 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C504 CAP,TANTAL,CHIP,MAKER ECTZ0003101 33 uF,10V ,M ,STD ,ETC ,R/TP C505 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 125 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C536 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C537 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C538 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C539 CAP,CHIP,MAKER ECZH0000826...
  • Page 126 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L504 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , L505 INDUCTOR,CHIP ELCH0001407 5.6 nH,S ,1005 ,R/TP ,PBFREE L506 INDUCTOR,CHIP ELCH0010502 33 nH,J ,1005 ,R/TP ,Laser Cutting Type L507 INDUCTOR,CHIP ELCH0010502...
  • Page 127 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R205 RES,CHIP ERHY0000187 6.8 Kohm,1/16W ,F ,1005 ,R/TP R206 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R207 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R208 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP R209 RES,CHIP ERHY0000282 120K ohm,1/16W,J,1005,R/TP R210...
  • Page 128 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R310 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R313 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R314 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP R315 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R316 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R317 RES,CHIP ERHY0000201...
  • Page 129 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R504 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP R505 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R506 RES,CHIP ERHY0000229 300 ohm,1/16W,J,1005,R/TP R507 RES,CHIP ERHY0000235 560 ohm,1/16W,J,1005,R/TP R508 RES,CHIP ERHY0000235 560 ohm,1/16W,J,1005,R/TP R509 RES,CHIP ERHY0000235...
  • Page 130 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SOT-6 ,1.6 W,30 V,2.4 A,R/TP ,use for charge P- U303 TR,FET,P-CHANNEL EQFP0003301 CHANNEL FET TSSPJW12 ,12 PIN,R/TP ,BACKLIGHT CHARGE U401 EUSY0253601 PUMP20mAX3 35 dBm,55 %,2 A,-50 dBc,25 dB,6.0 * 6.0 * 1.4 ,SMD ,GSM U501 SMPY0008901 QUAD PAM...
  • Page 131 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark LD314 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD315 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD316 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED MIC201 MICROPHONE SUMY0010508...
  • Page 132: Accessory

    11. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,1000 mAh,1 CELL,PRISMATIC,C2000BATT.T: Center SBPL00 BATTERY PACK,LI-ION SBPL0080201 Blue 3, (Cingular, LDI : White), Pb-Free...
  • Page 133 Note...
  • Page 134 Note...

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