LG -A230 Service Manual page 155

Level Location No. Description
C122,
C206, Capacitor,
6
C246, Ceramic, Chip
C520
R211,
R212,
6 Resistor, Chip
R246,
R247
IC, Digital
6 U101 Baseband
Processor, GSM
6 R223 Resistor, Chip
FB200,
FB201,
6 FB202, Filter, Bead
FB203,
FB204
C107,
Capacitor,
6 C111,
Ceramic, Chip
C146
6 R233 Resistor, Chip
6 U200 IC, Mini ABB
R103,
6 Resistor, Chip
R236
R100,
PCB ASSY, MAIN,
6 R217,
PAD SHORT
R243
R319,
R320,
6 R321, Resistor, Chip
R322,
R323
Inductor,
6 L517
Multilayer, Chip
6 Q200 FET
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
PartNumber
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C
ECCH0007803 1608 R/TP 0.8MM SAMSUNG ELECTRO-
MECHANICS CO., LTD.
MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP -
ERHZ0000435
ROHM.
PMB8815 , 281, EDGE Rx, ARM11 208MHz, NAND
booting, 2.0Mp, FMR, IC, Digital Baseband Processor
EUSY0429401
BGA R/TP 281P INFINEON TECHNOLOGIES (ASIA
PACIFIC) PTE LTD.
RC1005F394CS 390KOHM 1% 1/16W 1005 R/TP -
ERHY0000166
SAMSUNG ELECTRO-MECHANICS CO., LTD.
BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25% 1.4
SFBH0008105 ohm 0.1A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
C1005X5R1A224KT000E 220nF 10% 10V X5R -
ECZH0001216
55TO+85C 1005 R/TP - TDK KOREA COOPERATION
MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP -
ERHZ0000295
ROHM.
RT8966AGQW RT8966A 1.65~5.5V 60uA
SWITCH/MULTIPLEXER QFN R/TP 32P Mini ABB
EAN62112401 MUIC, Charger IC, Current Sink 4Ch, LDO 4Ch
RICHTEK TECHNOLOGY CORP. QFN R/TP 32P
RICHTEK TECHNOLOGY CORP.
MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -
ERHZ0000204
ROHM.
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP -
ERHY0000275
ROHM.
HK1005 12NJ 12NH 5% - 300mA 0.4OHM 2.7GHZ 8
ELCH0005003 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO., LTD
2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A 40OHM
EQFP0000101
100mW SSM R/TP 3P TOSHIBA
- 155 -
Spec
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