Diagrams - Sony D-VM1 Service Manual

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side A) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side B) the parts face are indicated.
* Replacement of IC902, IC1002 used in this set requires a special
tool.
• Lead Layouts
surface
Lead layout of
conventional IC CSP (chip size package)
C
Q These are omitted.
B E
• MAIN board and TFT board consist of multiple layers.
However, only the sides (layers) A and B are shown.
SECTION 5

DIAGRAMS

Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise speci-
4
fied.
• % : indicates tolerance.
f
• : internal component.
• 5 : fusible resistor.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 10 V and fed with regulated dc power
supply from DC IN jack (J401).
• Voltages and waveforms are dc with respect to ground in play-
back mode.
no mark : DVD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J : CD
c : DVD
a
: Y
: B-Y
: R-Y
* Replacement of IC902, IC1002 used in this set requires a
special tool.
• The voltage and waveform of CSP (chip size package) can-
not be measured, because its lead layout is different from
that of conventional IC.
• WAVEFORMS
TFT BOARD
1
3
IC1404 eh (G OUT) IC1404 es (B OUT)
[Test Mode Color Bar] [Test Mode Color Bar]
9.9 Vp-p
2 4
IC1404 ef (R OUT) IC1404 wa (CKO)
[Test Mode Color Bar]
9.9 Vp-p
44 Ns
MAIN BOARD
1 8
TP1049 (V OUT) TP629 (TE)
[Test Mode Color Bar]
1.3 Vp-p
H
2
9
TP1050 (C OUT) IC1602 3 (CLK)
[Color Bar]
870 mVp-p
H 5.4 µ sec
3 q;
TP1051 (Y OUT) IC1101 4 (MO3)
[Color Bar]
1.1 Vp-p
37 nsec
H H
4 qa
TP1052 (Y-G) IC1101 9 (XO)
[Test Mode Color Bar]
1.1 Vp-p 37 nsec
H
5 qs
TP1053 (CR-B)
IC1101 qs (SO1)
[Test Mode Color Bar]
30 nsec
800 mVp-p
H
6 qd
TP1054 (CB-R) IC1101 qh (SO3)
[Test Mode Color Bar]
41 nsec
800 mVp-p
H
7 qf
TP628 (FE)
IC1101 w; (SO2)
330 mVp-p
54 ns
21 21
10 Vp-p
3.9 Vp-p
qg ws
IC1101 wf (MO2) TP502 (S1)
1.3 Vp-p
4.6 Vp-p
2.4 Vp-p
37 ns
H
qh wd
IC1104 td (X1) TP503 (S2)
3.2 Vp-p
3.9 Vp-p
80 nsec 2.0 Vp-p
H
qj wf
TP530 (R-Y)
IC2002 wl (XOUT)
3.4 Vp-p
238 nsec 740 mVp-p
H
5.7 Vp-p
qk
wg
TP405 3 (OUT-4) TP514 (B-Y)
750 mV
2.2 µ sec
4.0 Vp-p
740 mVp-p
H
ql
wh
IC405 eh (OUT-1) TP537 (Y)
3.9 Vp-p
1.3 Vp-p
390 mVp-p
2.2 µ sec
H
w;
IC405 ra (OUT-2)
740 mV
2.2 µ sec
4.3 Vp-p
wa
TP501 (C OUT)
2.7 Vp-p
H
4.1 Vp-p
D-VM1