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ST TDA7375V Manual
ST TDA7375V Manual

ST TDA7375V Manual

2 x 35w dual/quad power amplifier for car radio

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1
FEATURES
HIGH OUTPUT POWER CAPABILITY:
– 2 x 40W max./4
– 2 x 35W/4 EIAJ
– 2 x 35W/4 EIAJ
– 2 x 25W/4 @14.4V, 1KHz, 10%
– 4 x 7W/4 @14.4V,1KHz, 10%
– 4 x 12W/2 @14.4V, 1KHz, 10%
MINIMUM EXTERNAL COMPONENTS
COUNT:
– NO BOOTSTRAP CAPACITORS
– NO BOUCHEROT CELLS
– INTERNALLY FIXED GAIN (26dB BTL)
ST-BY FUNCTION (CMOS COMPATIBLE)
NO AUDIBLE POP DURING ST-BY
OPERATIONS
DIAGNOSTICS FACILITY FOR:
– CLIPPING
– OUT TO GND SHORT
– OUT TO V
SHORT
S
– SOFT SHORT AT TURN-ON
– THERMAL SHUTDOWN PROXIMITY
Figure 2. Block Diagram
September 2013
2 x 35W dual/quad power amplifier for car radio
Figure 1. Package
MULTIWATT15
Table 1. Order Codes
Part Number
TDA7375V
2
PROTECTIONS:
OUPUT AC/DC SHORT CIRCUIT
– TO GND
– TO V
S
– ACROSS THE LOAD
SOFT SHORT AT TURN-ON
OVERRATING CHIP TEMPERATURE WITH
SOFT THERMAL LIMITER
LOAD DUMP VOLTAGESURGE
VERY INDUCTIVE LOADS
FORTUITOUS OPEN GND
REVERSED BATTERY
ESD
TDA7375V
Package
MULTIWATT 15 (Vertical)
Rev. 5
1/15

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Summary of Contents for ST TDA7375V

  • Page 1 OUPUT AC/DC SHORT CIRCUIT ■ – INTERNALLY FIXED GAIN (26dB BTL) – TO GND ST-BY FUNCTION (CMOS COMPATIBLE) ■ – TO V NO AUDIBLE POP DURING ST-BY – ACROSS THE LOAD ■ OPERATIONS SOFT SHORT AT TURN-ON ■ OVERRATING CHIP TEMPERATURE WITH ■...
  • Page 2 TDA7375V DESCRIPTION The TDA7375V is a new technology class AB car radio amplifier able to work either in DUAL BRIDGE or QUAD SINGLE ENDED configuration. The exclusive fully complementary structure of the output stage and the internally fixed gain guarantees the highest possible power performances with extremely reduced component count.
  • Page 3 Supply Voltage Rejection = 0; f = 300Hz Stand-by Attenuation = 1W A ST-BY Current Consumption = 0 to 1.5V ST-BY ST-BY In Threshold Voltage ST-BY Out Threshold Voltage A ST-BY Pin Current Play Mode V = 5V pin7 pin7 Max Driving Curr.
  • Page 4 TDA7375V STANDARD TEST AND APPLICATION CIRCUIT Figure 4. Quad Stereo 10K R1 ST-BY 10μF 100nF 1000μF IN FL C1 0.22μF C10 2200μF OUT FL IN FR C2 0.22μF C9 2200μF OUT FR IN RL C4 0.22μF IN RR C11 2200μF OUT RL C3 0.22μF...
  • Page 5 TDA7375V Figure 7. P.C. Board and Component Layout of the fig.4 Figure 8. P.C. Board and Component Layout of the fig.5 5/15...
  • Page 6 TDA7375V Figure 9. Quiescent Drain Current vs. Supply Figure 12. Output Power vs. Supply Voltage Voltage (Single Ended and Bridge). Figure 13. OutputPower vs. Supply Voltage Figure 10. Quiescent Output Voltage vs. Supply Voltage (Single Ended and Bridge). Figure 11. Output Power vs. Supply Voltage Figure 14.
  • Page 7 TDA7375V Figure 15. Distortion vs. Output Power Figure 18. Supply Voltage Rejection vs. Frequency Figure 19. Supply Voltage Rejection vs. Figure 16. Distortion vs. Output Power Frequency Figure 17. Cross-talk vs. Frequency Figure 20. Stand-by Attenuation vs. Threshold Voltage 7/15...
  • Page 8: General Structure

    TDA7375V Figure 21. Total Power Dissipation and Figure 22. Total Power Dissipation and Efficiency vs. Output Power Efficiency vs. Output Power GENERAL STRUCTURE 5.1 High Application Flexibility The availability of 4 independent channels makes it possible to accomplish several kinds of applications ranging from 4 speakers stereo (F/R) to 2 speakers bridge solutions.
  • Page 9 The fully complementary output stage was made possible by the development of a new component: the ST exclusive power ICV PNP. A novel design based upon the connection shown in fig. 23 has then allowed the full exploitation of its pos- sibilities.
  • Page 10 This particular kind of protection acts in a way to avoid that the device is turned on (by ST-BY) when a resistive path (less than 16 ohms) is present between the output and GND. As the involved circuitry is nor- mally disabled when a current higher than 5mA is flowing into the ST-BY pin, it is important, in order not to disable it, to have the external current source driving the ST-BY pin limited to 5mA.
  • Page 11 TDA7375V Figure 26. Output Fault Waveforms (see fig. 27) Figure 27. Fault Waveforms 5.8 HANDLING OF THE DIAGNOSTICS INFORMATION As various kinds of information is available at the same pin (clipping detection, output fault, thermal prox- imity), this signal must be handled properly in order to discriminate each event.
  • Page 12 TDA7375V Figure 28. Waveforms Figure 29. Interface circuitry to differentiate the information schematic 5.9 PCB-LAYOUT GROUNDING (general rules) The device has 2 distinct ground leads, P-GND (POWER GROUND) and S-GND (SIGNAL GROUND) which are practically disconnected from each other at chip level. Proper operation requires that P-GND and S-GND leads be connected together on the PCB-layout by means of reasonably low-resistance tracks.
  • Page 13: Package Information

    TDA7375V PACKAGE INFORMATION In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the pack- age and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings re- lated to soldering conditions are also marked on the inner box label.
  • Page 14: Revision History

    TDA7375V REVISION HISTORY Table 5. Revision History Date Revision Description of Changes July 2004 First Issue in EDOCS March 2005 Changed the Style-sheet in compliance to the new “Corporate Technical Pubblications Design Guide”. Deleted package Multiwatt15 Horizontal. 01-Jul-2008 Updated the root part number in the title of the cover page.
  • Page 15 No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.