Table Of Contents - Sony STR-KS1200 Service Manual

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STR-KS1200
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Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTE OF REPLACING THE IC3511 AND IC3513 ON
THE HDMI RE BOARD
TE
IC3511 and IC3513 on the HDMI RE board cannot exchange with
L 13942296513
single. When IC3511 and IC3513 on the HDMI RE board are dam-
aged, exchange the entire mounted board.
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SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
.
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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TABLE OF CONTENTS

1.
..................................................................
2.
2-1. Disassembly Flow ..........................................................
2-2. Case (SL07) ...................................................................
2-3. HDMI RE Board .............................................................
2-4. Front Panel Block ..........................................................
2-5. MAIN Board ...................................................................
3.
............................................................
4.
5.
5-1. Block Diagram - MAIN Section - .................................. 10
5-2. Block Diagram - HDMI Section - .................................. 11
5-3. Block Diagram - DSP Section - ..................................... 12
5-4. Block Diagram - AMP Section - .................................... 13
- MAIN Board (Component Side) - ............................... 16
- MAIN Board (Conductor Side) - ................................. 17
5-12. Schematic Diagram - MAIN Board (5/10) - .................. 22
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5-22. Printed Wiring Board - IO Board - ................................ 33
5-23. Schematic Diagram - IO Board - .................................... 33
5-27. Schematic Diagram - PANEL Section - ......................... 37
5-28. Printed Wiring Board - SMPS Board - ........................... 38
5-29. Schematic Diagram - SMPS Board - .............................. 39
6.
6-1. Case, HDMI RE Board Section ..................................... 58
6-2. Front Panel Section ........................................................ 59
6-3. MAIN Board Section ..................................................... 60
7.
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