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CFD-S700
Ver 1.1 2003.03
QQ
3 7 63 1515 0
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
TE
L 13942296513
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
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TABLE OF CONTENTS
......................................................... 3
............................................................................ 4
3-1. Cabinet (Front) Assy ....................................................... 6
3-2. Wires ............................................................................... 6
CONTROL (1) Board ..................................................... 7
3-4. INLET Board, POWER Board ....................................... 7
3-5. Cabinet (Upper) Assy ..................................................... 8
3-6. BATTERY (2) Board, BATTERY (1) Board .................. 8
3-7. POWER AMP Board, MAIN Board ............................... 9
3-8. Tape Mechanism Block (MF-V5-117) ........................... 9
3-9. Cassette Holder Assy .................................................... 10
3-10. PRE Board .................................................................... 10
HRP301 (Magnetic Head) ........................................... 11
3-12. CD Board ..................................................................... 11
3-13. CD Mechanism Deck (KSM-213RDP) ........................ 12
3-14. Optical Pick-up (KSS-213R) ....................................... 12
Tape Section .......................................................................... 13
Tuner Section ......................................................................... 14
CD Section ............................................................................ 15
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6-1. IC Pin Description ........................................................ 16
6-2. Circuit Boards Location ................................................ 17
6-3. Block Diagram - CD Section - ................................ 18
6-4. Block Diagram - MAIN Section - ........................... 19
6-5. Printed Wiring Board - CD Section - ...................... 20
6-6. Schematic Diagram - CD Section - ......................... 21
6-7. Printed Wiring Boards - MAIN Section - ................ 22
6-8. Schematic Diagram - MAIN Section (1/3) - ........... 23
6-9. Schematic Diagram - MAIN Section (2/3) - ........... 24
6-10. Schematic Diagram - MAIN Section (3/3) - ........... 25
6-11. Printed Wiring Boards - PRE Board - ..................... 26
6-12. Schematic Diagram - PRE Board - ......................... 26
6-13. Printed Wiring Boards - CONTROL Section - ....... 27
6-14. Schematic Diagrams - CONTROL Section - .......... 28
- POWER SUPPLY Section - .................................. 29
6-16. Schematic Diagrams
- POWER SUPPLY Section - .................................. 30
7-1. Cabinet (Front) Section ................................................ 34
7-2. Cabinet (Rear) Section .................................................. 35
7-3. Cabinet (Upper) Section ............................................... 36
7-4. Tape Mechanism Section -1 .......................................... 37
7-5. Tape Mechanism Section -2 .......................................... 38
7-6. Optical Pick-up Section (KSM-213RDP) ..................... 39
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