Table Of Contents - Sony NW-S4 Service Manual

NW-S4

TABLE OF CONTENTS

1. SERVICING NOTES
2. GENERAL
...................................................................... 8
3. DISASSEMBLY
3-1. Disassembly Flow .............................................................. 9
3-2. Lower Case Assy ................................................................ 9
3-3. Jack Flexible Module,
Jack (Small Type) (Water Proof) (J301) .......................... 10
3-4. MAIN Board .................................................................... 10
3-5. SUB Board ....................................................................... 11
4. DIAGRAMS
4-1. Block Diagram ................................................................. 13
4-2. Note for Printed Wiring Boards and
Schematic Diagrams ........................................................ 14
4-3. Printed Wiring Board - MAIN Board - ......................... 15
4-4. Schematic Diagram - MAIN Board (1/2) - ................... 16
4-5. Schematic Diagram - MAIN Board (2/2) - ................... 17
4-6. Printed Wiring Boards - SUB Board - .......................... 18
4-7. Schematic Diagram - SUB Board - ............................... 19
4-8. IC Pin Function Description ............................................ 21
5. EXPLODED VIEWS
5-1. Upper Case Assy .............................................................. 25
5-2. Board Assy ....................................................................... 26
6. ELECTRICAL PARTS LIST
Network Walkman is trademark of Sony
Corporation.
OpenMG and its logo are trademarks of Sony
Corporation.
WALKMAN is a registered trademark of Sony
Corporation.
Microsoft, Windows, Windows NT, Windows
Media, Windows Millennium Edition and their
logos are trademarks or registered trademarks of
Microsoft Corporation in the United States and/or
other countries.
US and foreign patents licensed from Dolby
Laboratories.
All other trademarks and registered trademarks are
trademarks or registered trademarks of their
respective holders.
2
.................................................. 3
................................ 27
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.