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Q Q
6-8. PRINTED WIRING BOARD – DMB12 BOARD (SIDE B) –
3 7 6 3 1 5 1 5 0
T E
L
1 3 9 4 2 2 9 6 5 1 3
w w w
HCD-DZ820KW
• See page 27 for Circuit Boards Location.
RB105
RB106
C158
R156
R1201
R148
R1150
R1151
R147
R1152
R145
C127
IC105
C131
1
5
C128
R1170
R103
3
4
R1139
FB115
R210
R207
R204
C208
R216
R208
C205
C213
C206
R213
R215 R205
R206
R219
R222
C210
R227
R224
R228
R239 R237
R236
C226
C225
R2505
R243
x
a o
y
.
i
http://www.xiaoyu163.com
:Uses unleaded solder.
IC150
R1501
R1503
1
5
4
R1502
3
C1501
R780
R133
R1184
R138
R1123
R1124
R1125
C176
C174
R173
R1122
R172
C163
R139
R1121
R1120
IC111
Q
C157
Q
4
3
3
7
6
6
1
R141
R1169
R1168
C148
C151
C126
C142
C145
C125
C138
C143
R132
C139
C116
C133
C135
C120
C132
R136
C121
C122
5
4
C123
C124
1
3
IC107
C192
C115
IC4502
R1134
R112
R113
R101
R109
R115
C106
R124
R110
R123
E1
C1
1
R121
C113
B2
B1
R120
R114
E1
C2
R118
u 1 6 3
.
35
35
http://www.xiaoyu163.com
2
4
8
9
9
New part of EEP ROM (IC103, IC706) on the DMB12 board cannot be used.
Therefore, if the mounted MAIN board (A-1166-695-A, A-1166-728-A) is replaced,
exchange new EEP ROM (IC103, IC706) with that used before the replacement.
R754
C730
1
5
IC705
C729
3
4
3
4
R752
R788
5
1
R753
R766
R751
R744
R749
R747
G
R783
C714
D
R748
C712
G
S
R743
D
R745
R787
S
R701
Q701
C711
R1751
R714
R730
C734
IC706
IC703
R1706
R738
4
3
C720
C723
5
1
R740
C717
IC702
3
1
R734
3
1
5
1
5
0
8
9
2
4
5
R736
R1705
20
11
5
IC4501
1
3
1
10
R4518
FL602
R4718
m
c o
HCD-DZ820KW
2
8
9
9
• Semiconductor
Location
Ref. No.
Location
IC105
D-2
IC107
E-5
IC111
D-5
IC150
B-4
IC702
D-7
IC703
C-8
IC705
B-8
IC706
C-8
IC707
B-7
IC4501
E-7
IC4502
E-6
Q102
G-5
Q701
B-6
Q702
B-6
4
9
8
2
9
9
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