Sony Walkman NW-HD1 Service Manual page 50

NW-HD1
1. DIAGRAMS
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN and HDD boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in diagram.
* Replacement of IC1003, 1101, 2001, 3001, 7001 and 7002
used in this set requires a special tool.
• Lead Layouts
Lead layout of conventional IC
2
surface
CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
specified.
•
: internal component.
f
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti-
pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified. spécifié.
• A : B+ Line.
• Power voltage is dc 4.2 V and fed with regulated dc power
supply from CN9501.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
* Replacement of IC1003, 1101, 2001, 3001, 7001 and 7002
used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
W or less unless otherwise