Philips MDV434/55/77 Service Manual page 5

Warnings, Notes
Lead-Free requirement for service
INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from
rules.
Important note: In fact also products a little older can
also be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always
use SAC305 and the higher temperatures belong to
this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622
solder-paste is required,
manufacturer of your solder-equipment. In general
use of solder-paste within workshops should be
avoided because paste is not easy to store and to
handle.
• Use only adequate solder tools applicable for
lead-free solder alloy. The solder tool must be able
o To reach at least a solder-temperature of
400°C,
o To stabilize the adjusted temperature at the
solder-tip
o To exchange
applications.
• Adjust your solder tool so that a temperature around
360°C – 380°C is reached and stabilized at the
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed
solder alloy types (leaded and lead-free). If one
cannot avoid, clean carefully the
solder-joint from old solder alloy and re-solder with
new solder alloy (SAC305).
1.1.2005
onwards, according next
149 00106. If lead-free
please contact
solder-tips for different
1-5
•
Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at
external companies.
•
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
de-soldering always use highest lead-free
temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in
so-called
including a silica gel pack) to protect the IC
the
against moisture. After opening, dependent of
MSL-level seen on indicator-label in the bag,
the BGA-IC possibly still has to be baked dry.
This will be communicated via AYS-website.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all
needed spare-parts will be available till the
end of the service-period. For repair of such
sets nothing changes.
• On our website:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used
in Philips-sets
You will find this and more technical
information within the "magazine", chapter
"workshop news".
For additional questions please contact your local
repair-helpdesk.
'dry-packaging' (sealed pack