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CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
TE
L 13942296513
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
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NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
.
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
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TABLE OF CONTENTS
1.
Buttons, and LED's ........................................................
1-3. Extension Cable .............................................................. 3
2.
.................................................................. 4
3.
3-1. Cover and Front Panel ....................................................
3-2. Mechanism Deck ............................................................
3-3. Digital Board .................................................................. 5
3-4. OPJ Board, Power Board ................................................ 6
3-5. Bracket (T), (L) and (R) ................................................. 6
3-6. BD Board ........................................................................ 7
3-7. Sub Chassis ..................................................................... 7
3-8. Shutter Assembly ............................................................
3-9. Over Write Head .............................................................
3-10. Slider Complete Assembly ............................................. 9
4.
TEST MODE ........................................................
5.
6.
6-1. Circuit Boards Location ................................................. 18
6-2. Block Diagram ............................................................... 19
6-3. Printed Wiring Boards
- MD Mechanism Deck Section - ................................. 22
6-4. Schematic Diagram
- MD Mechanism Deck Section - ................................. 25
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6-5. Schematic Diagram - Digital Section - ......................... 31
6-6. Printed Wiring Boards - Digital Section - ..................... 35
6-7. Schematic Diagram - Display Section - ........................ 38
6-8. Printed Wiring Boards - Display Section - .................... 41
6-9. Printed Wiring Boards - Power Section - ...................... 43
6-10. Schematic Diagram - Power Section - .......................... 45
6-11. IC Block Diagrams ......................................................... 47
6-12. IC Pin Functions ............................................................. 49
7.
8.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged
by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
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CAUTION
Danger of explosion if battery is incorrectly replaced.
.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer's instructions.
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