Table of Content
1
Key Features ..............................................................................................................................3
2
3
Unit Description of SXG75........................................................................................................6
4
Exploded View of SXG75 ..........................................................................................................7
5
Disassembly of SXG75 .............................................................................................................8
6
Assembly of SXG75 ................................................................................................................18
7
8
9
15 Hardware requirements ..........................................................................................................50
16 SXG75 Board layout ................................................................................................................51
17 SIM Card Problems .................................................................................................................52
18 IO Connector Problems ..........................................................................................................53
22 IRDA Problems ........................................................................................................................58
23 Display Problems ....................................................................................................................59
24 MMC Connector Problems......................................................................................................60
Technical Documentation
TD_Repair_L1-L3_SXG75_R1.1.pdf
Company Confidential
2005©BenQ
Release 1.1
11/2005
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