Circuit Boards Location - Sony CDP-XE510 Service Manual

6-2. CIRCUIT BOARDS LOCATION

LOADING board
POWER SW board
PANEL board
BD board
MAIN board
HP board
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THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each
block.)
• Printed wiring boards.
• : parts extracted from the component side.
• : parts extracted from the conductor side.
• ® : Through hole.
• : Pattern from the side which enable seeing.
(The other layer's patterns are not indicated.)
• Schematic diagrams.
• All capacitors are in µF unless otherwise noted. pF : µµF 50WV
or less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4W or less unless otherwise speci-
fied.
• ¢ : internal component.
• : panel designation.
Note : The components identified by mark ! or dotted
line with mark ! are critical for safety.
Replace only with part number specified.
• B+ : B+ Line
• : B– Line
B–
• Voltage and waveforms are dc with respect to ground under no-
signal conditions.
no mark : STOP
• Voltages are taken with a VOM (Input impedance 10MΩ).
Voltage variations may be noted due to normal production tol-
erances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tol-
erances.
• Circled numbers refer to waveforms.
• Signal path.
: CD
: digital out
CDP-XE510
• Waveforms
1
1.3Vp-p
(PLAY)
IC101 #§ RFAC
2
2.5V
APPROX 500mVp-p (PLAY)
IC101 @¶ TE
3
2.5V
APPROX 200mVp-p (PLAY)
IC101 @ª FE
4
2.6Vp-p
7.5 µsec
(PLAY)
IC101 (§ MDP
5
3.8Vp-p
8MHz
IC621 #¡ EXTAL
6
4.8Vp-p
16.9MHz
IC661 6 384FS
7
5Vp-p
2.1MHz
IC661 0 BCK
8
3.2Vp-p
33.8MHz
IC661 @¡ XOUT
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