Sony D-NE330 Service Manual page 33

1-2. PRINTED WIRING BOARD – MAIN Board (Conductor Side) –
1 2
MAIN BOARD (CONDUCTOR SIDE)
A
B
C821
C439
C414
1
C
C415
C416
S802
HOLD
HOLD
r
OFF
20
D
+ C423
C428
C430
C426
C451
E
E
F Q402
C
J401
DC IN 3V
G
– +
(NE330: US, CND)
H
J301
i
D101, 201, 302 – 304, 441
I
D-NE330/NE331
: Uses unleaded solder.
3 4 5
C445
R457
W402
D406
R455
C452
80 61
60
C851
R417
(NE330: US, CND)
D441
D410
R423
IC401
K A
R425
Q407 E C B
R426
41
21 40
Q405
C429
1 8
Q411
C433
E C B
C435
4 5
R465
C434
+
C431
E C B
Q412
C432
C461
R406
C460
R401
Q408
B
CB605
R470
B C E
Q406
R405
B C E RB601
R404
R612
R411
C409
D403
D303
D302
D201
C205 +
R214 R213
5 4
IC301
C304
FB101
R208
R108
1
8
R104
C107
C302 R302
R105
C308
C113 Q303
C111
Q302
C110
S
D
G
R308
6 7 8
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
1PC. 1.5V
R851
5
8
IC802
1 4
R820
C845
R894
X601
37 36
C894 C836 C835
R819
(EXCEPT NE330: US, CND)
R807
C842
C843
C803
C841
C834
72
1
IC801
73
144
C833
C862
R618
1
R611
R610
R601
108 109
C828
C829
C611 R615
C831
R613
C832
C607
C610 R604
IC851
C899
2 1 25
IC603
3 4
R867
26
5 4
IC302
1 3
S G
D
Q301
K A
D301
12
1-868-466- (12)
3 3
• Semiconductor
9
Location
Ref. No. Location
D101
D201
D301
D302
D303
D304
D403
D406
D409
D410
D441
W401
IC301
IC302
D409
IC401
K (NE330: US, CND)
IC603
A
IC801
IC802
IC851
Q301
Q302
Q303
C805 Q402
Q405
Q406
Q407
Q408
Q411
Q412
1
A
CN604
SWITCH
BOARD
10
CN1002
(Refer to page 14
on service manual)
50
R866
When MAIN board is replaced or EEPROM (IC802) on the MAIN board is
replaced, patch processing is needed.
Confirm about information of patch processing to each service headquarters.
D-NE330/NE331
G-3
G-3
I-6
G-3
G-3
G-3
F-3
C-4
C-9
C-5
C-4
H-4
I-6
C-3
H-6
E-7
D-7
G-8
I-6
I-5
I-5
F-3
D-4
F-3
D-4
F-3
D-5
E-3