B. ADF ..............................................1-2
targets .....................................1-2
C. Sensors ........................................3-6
E. PCBs ..........................................3-10
CONTENTS
1. Storage when the packing
seal is intact ............................1-4
2. Storage and handling when
the packing seal has been
opened ....................................1-5
2. Image positioning
adjustment...............................2-8
3. Sensor check ........................2-11
4. Image processor PCB
replacement procedures .......2-13
1. Height check .........................2-14
2. Height adjustment .................2-15
1. Checking ADF skew feed ......2-16
2. Adjusting skew feed ..............2-17
1. Checking image position .......2-18
2. Adjusting image position .......2-21
PCB .......................................3-14
6. ADF .......................................3-19
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2
3
4
5
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