Table Of Contents - Sony MZ-E10 Service Manual

MZ-E10
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.
Discard used batteries according to the manufacturer's instruc-
tions.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande föreskrifter.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan
tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden
mukaisesti.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS
PUBLIÉS PAR SONY.
2

TABLE OF CONTENTS

Specifications ........................................................................... 1
1. SERVICING NOTE
...................................................... 3
2. GENERAL
Playing an MD ................................................................... 4
3. DISASSEMBLY
3-1. Panel assy (S), Upper ................................................. 5
3-2. Mechanism Deck (MT-MZE10-184) .......................... 5
3-3. Bracket assy ............................................................... 6
3-4. Power Board, Main Board .......................................... 6
3-5. Control Board ............................................................. 7
3-6. Optical Pick-up assy(ABX-1ES) ................................ 7
4. TEST MODE
.................................................................. 8
5. ELECTRICAL ADJUSTMENTS
6. DIAGRAMS
6-1. Block Diagram .......................................................... 19
6-2. Printed Wiring Boards - Main Section (1/2) - ......... 20
6-3. Printed Wiring Boards - Main Section (2/2) - ......... 21
6-4. Schematic Diagram - Main Section (1/3) - ............. 22
6-5. Schematic Diagram - Main Section (2/3) - ............. 23
6-6. Schematic Diagram - Main Section (3/3) - ............. 24
6-7. IC Pin Function Descrintion ..................................... 26
6-8. IC Block Diagrams ................................................... 30
7. EXPLODED VIEWS
7-1. Main Section ............................................................. 33
7-2. Mechanism Deck Section (MT-MZE10-184) ........... 34
8. ELECTRICAL PARTS LIST
UNLEADED SOLDER
r
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
* Replacement of SN761058ZQL (IC501) and LC896442-VH4-
16-E (IC601) used in this set requires a special tool.
............................ 11
................................... 35