Samsung ML-1610XBH Service Manual page 121

Reference Information
11.2 Acronyms and Abbreviations(1)
The table below explains the abbreviations and acronyms used in this service manual. Where abbreviations
or acronyms are used in the text please refer to this table.
Abbreviations
AP
AC
APC
ASIC
ASSY
BIOS
BLDC
CMOS
CN
CON
CPU
dB
dbA
dBM
DC
DCU
DPI
DRAM
DVM
ECP
EDC
EEPROM
EMI
EP
EPP
FPOT
F/W
GDI
GND
HBP
HDD
H/H
HV
HVPS
I/F
I/O
IC
IDE
Service Manual
11-2
Explanation
Access Point
Alternating Current
Auto Power Control
Application Specific Integrated Circuit
assembly
Basic Input Output System
Brush-less Direct Current
Complementary Metal Oxide Semiconductor
connector
connector
Central Processing Unit
decibel
decibel A
decibel milliwatt
direct current
Diagnostic Control Unit
Dot Per Inch
Dynamic Random Access Memory
Digital Voltmeter
Enhanced Capability Port
Embedded Diagnostic control
Electronically Erasable Programmable Read Only Memory
Electro Magnetic Interference
electrophotographic
Enhanced Parallel Port
First Printout Time
firmware
graphics device interface
ground
Host Based Printing
Hard Disk Drive
High temperature and high marshy place
high voltage
High Voltage Power Supply
interface
Input and Output
integrated circuit
Intelligent Drive electronics or Imbedded Drive Electronics
Samsung Electronics