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EN 6
2.
FM242 AA
Safety Instructions, Warnings, and Notes
Device replacement
The last step in the repair process is to solder the new
component on the board. Ideally, the (LF)BGA should be
aligned under a microscope or magnifying glass. If this is not
possible, try to align the (LF)BGA with any board markers.
To reflow the solder, apply a temperature profile according to
the IC data sheet. So as not to damage neighbouring
components, it may be necessary to reduce some
temperatures and times.
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