Thermal Specifications; Case Temperature And Thermal Design Power; Case Temperature Metrology; Intel ® 6300Esb I/O Controller Hub Thermal Specifications - Intel I/O Controller Hub 6300ESB Design Manual

3.0

Thermal Specifications

3.1

Case Temperature and Thermal Design Power

To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and
junction temperatures must be at or below the values specified in
component level thermal solutions are required to maintain the case temperature below the
maximum temperature specification while dissipating the thermal design power (TDP) listed in
Table 3.
®
Table 3. Intel 6300ESB I/O Controller Hub Thermal Specifications
NOTES:
1. T
case-nhs
thermal solution attached.
2. T
j-max
measured at the hottest point in the processor die.
3.2

Case Temperature Metrology

The component case temperature should be measured by attaching a thermocouple to the geometric
center of the package case top. Refer to
dimensions.
®
Intel 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
Parameter
T
case-nhs
T
j-max
TDP
is defined as the maximum package case temperature without a
is defined as the maximum component temperature specification
Maximum
105 °C
115 °C
3.9 W
Appendix A, "Mechanical Drawings"
Thermal Specifications
Table 3. System and/or
Notes
1
2
for package
9